MOUNTED SEMICONDUCTOR DEVICE AND A METHOD FOR MAKING THE SAME

A method for mounting a semiconductor device onto a composite substrate, including a submount and a heat sink, is described. According to one aspect of the invention, the materials for the submount and the heat sink are chosen so that the value of coefficient of thermal expansion of the semiconducto...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BAJWA SUKBHIR, WONG ANDRE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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