OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS
Provided is a method of providing an opto-electrical assembly. The method comprises attaching a second electrical element to a carrier using a second attachment region at a second attaching temperature. The second attaching temperature is associated with the melting temperature of the second attachm...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | JOHANSSON ASA CHRISTINA STEIJER ODD ROBERT ANDERSSON HANS MAGNUS EMIL KAELLEN MARIA ELISABETH LUNDQVIST LENNART PER OLOF EK SYLVIA ANNA-KARIN |
| description | Provided is a method of providing an opto-electrical assembly. The method comprises attaching a second electrical element to a carrier using a second attachment region at a second attaching temperature. The second attaching temperature is associated with the melting temperature of the second attachment region, such as the melting temperature of solder or the like. The carrier already comprises a first opto-electrical element having been attached to the carrier using a first attachment region at a first attaching temperature, whereby the first attaching temperature is associated with the melting temperature of the first attachment region. The method is provided such that the second attachment region has a lower melting temperature than the first attachment region such that the second attaching temperature is lower than the first attaching temperature. The resulting opto-electrical carrier assembly is compatible to industry-standard RoHS-compliant solder reflow attachment schemes to PCB and ceramic substrates (and similar). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2011089438A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2011089438A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2011089438A13</originalsourceid><addsrcrecordid>eNrjZLD3Dwjx13X1cXUOCfJ0dvRRcAwOdvV18vF0DVZw9HMBcf2dPR1DXIHMgADHIMeQUIiEr2uIh79LMA8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstiQ8NNjIwNDSwsDQxtnA0NCZOFQAv0Ctc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS</title><source>esp@cenet</source><creator>JOHANSSON ASA CHRISTINA ; STEIJER ODD ROBERT ; ANDERSSON HANS MAGNUS EMIL ; KAELLEN MARIA ELISABETH ; LUNDQVIST LENNART PER OLOF ; EK SYLVIA ANNA-KARIN</creator><creatorcontrib>JOHANSSON ASA CHRISTINA ; STEIJER ODD ROBERT ; ANDERSSON HANS MAGNUS EMIL ; KAELLEN MARIA ELISABETH ; LUNDQVIST LENNART PER OLOF ; EK SYLVIA ANNA-KARIN</creatorcontrib><description>Provided is a method of providing an opto-electrical assembly. The method comprises attaching a second electrical element to a carrier using a second attachment region at a second attaching temperature. The second attaching temperature is associated with the melting temperature of the second attachment region, such as the melting temperature of solder or the like. The carrier already comprises a first opto-electrical element having been attached to the carrier using a first attachment region at a first attaching temperature, whereby the first attaching temperature is associated with the melting temperature of the first attachment region. The method is provided such that the second attachment region has a lower melting temperature than the first attachment region such that the second attaching temperature is lower than the first attaching temperature. The resulting opto-electrical carrier assembly is compatible to industry-standard RoHS-compliant solder reflow attachment schemes to PCB and ceramic substrates (and similar).</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110421&DB=EPODOC&CC=US&NR=2011089438A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110421&DB=EPODOC&CC=US&NR=2011089438A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JOHANSSON ASA CHRISTINA</creatorcontrib><creatorcontrib>STEIJER ODD ROBERT</creatorcontrib><creatorcontrib>ANDERSSON HANS MAGNUS EMIL</creatorcontrib><creatorcontrib>KAELLEN MARIA ELISABETH</creatorcontrib><creatorcontrib>LUNDQVIST LENNART PER OLOF</creatorcontrib><creatorcontrib>EK SYLVIA ANNA-KARIN</creatorcontrib><title>OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS</title><description>Provided is a method of providing an opto-electrical assembly. The method comprises attaching a second electrical element to a carrier using a second attachment region at a second attaching temperature. The second attaching temperature is associated with the melting temperature of the second attachment region, such as the melting temperature of solder or the like. The carrier already comprises a first opto-electrical element having been attached to the carrier using a first attachment region at a first attaching temperature, whereby the first attaching temperature is associated with the melting temperature of the first attachment region. The method is provided such that the second attachment region has a lower melting temperature than the first attachment region such that the second attaching temperature is lower than the first attaching temperature. The resulting opto-electrical carrier assembly is compatible to industry-standard RoHS-compliant solder reflow attachment schemes to PCB and ceramic substrates (and similar).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD3Dwjx13X1cXUOCfJ0dvRRcAwOdvV18vF0DVZw9HMBcf2dPR1DXIHMgADHIMeQUIiEr2uIh79LMA8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstiQ8NNjIwNDSwsDQxtnA0NCZOFQAv0Ctc</recordid><startdate>20110421</startdate><enddate>20110421</enddate><creator>JOHANSSON ASA CHRISTINA</creator><creator>STEIJER ODD ROBERT</creator><creator>ANDERSSON HANS MAGNUS EMIL</creator><creator>KAELLEN MARIA ELISABETH</creator><creator>LUNDQVIST LENNART PER OLOF</creator><creator>EK SYLVIA ANNA-KARIN</creator><scope>EVB</scope></search><sort><creationdate>20110421</creationdate><title>OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS</title><author>JOHANSSON ASA CHRISTINA ; STEIJER ODD ROBERT ; ANDERSSON HANS MAGNUS EMIL ; KAELLEN MARIA ELISABETH ; LUNDQVIST LENNART PER OLOF ; EK SYLVIA ANNA-KARIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2011089438A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JOHANSSON ASA CHRISTINA</creatorcontrib><creatorcontrib>STEIJER ODD ROBERT</creatorcontrib><creatorcontrib>ANDERSSON HANS MAGNUS EMIL</creatorcontrib><creatorcontrib>KAELLEN MARIA ELISABETH</creatorcontrib><creatorcontrib>LUNDQVIST LENNART PER OLOF</creatorcontrib><creatorcontrib>EK SYLVIA ANNA-KARIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JOHANSSON ASA CHRISTINA</au><au>STEIJER ODD ROBERT</au><au>ANDERSSON HANS MAGNUS EMIL</au><au>KAELLEN MARIA ELISABETH</au><au>LUNDQVIST LENNART PER OLOF</au><au>EK SYLVIA ANNA-KARIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS</title><date>2011-04-21</date><risdate>2011</risdate><abstract>Provided is a method of providing an opto-electrical assembly. The method comprises attaching a second electrical element to a carrier using a second attachment region at a second attaching temperature. The second attaching temperature is associated with the melting temperature of the second attachment region, such as the melting temperature of solder or the like. The carrier already comprises a first opto-electrical element having been attached to the carrier using a first attachment region at a first attaching temperature, whereby the first attaching temperature is associated with the melting temperature of the first attachment region. The method is provided such that the second attachment region has a lower melting temperature than the first attachment region such that the second attaching temperature is lower than the first attaching temperature. The resulting opto-electrical carrier assembly is compatible to industry-standard RoHS-compliant solder reflow attachment schemes to PCB and ceramic substrates (and similar).</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2011089438A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T18%3A18%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JOHANSSON%20ASA%20CHRISTINA&rft.date=2011-04-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2011089438A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |