EMBEDDED CHIP PACKAGE PROCESS

EMBEDDED CHIP PACKAGE PROCESS

An embedded chip package process is disclosed. A first substrate having a first patterned circuit layer is provided. A second substrate having a second patterned circuit layer is provided. A dielectric material layer is formed to cover the first patterned circuit layer. A compression process is perf...

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1. Verfasser: CHENG DAVID C. H
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHENG DAVID C. H
description An embedded chip package process is disclosed. A first substrate having a first patterned circuit layer is provided. A second substrate having a second patterned circuit layer is provided. A dielectric material layer is formed to cover the first patterned circuit layer. A compression process is performed to cover the second substrate over the dielectric material layer and the second patterned circuit layer is embed into the dielectric material layer. A curing process is performed to cure the dielectric material layer after the step of performing the compression process. At least a conductive plug through the dielectric material layer is formed to electrically connect the first patterned circuit layer to the second patterned circuit layer after the step of performing the curing process. The first substrate, the second substrate and a portion of the at least a conductive plug are removed after the step of forming the conductive through hole.
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H</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2011076802A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHENG DAVID C. H</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHENG DAVID C. H</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EMBEDDED CHIP PACKAGE PROCESS</title><date>2011-03-31</date><risdate>2011</risdate><abstract>An embedded chip package process is disclosed. A first substrate having a first patterned circuit layer is provided. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title EMBEDDED CHIP PACKAGE PROCESS
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