HIGHLY ELECTRICALLY CONDUCTIVE SURFACES FOR ELECTROCHEMICAL APPLICATIONS AND METHODS TO PRODUCE SAME

A method to use a novel structured metal-ceramic composite powder to improve the surface electrical conductivity of corrosion resistant metal substrates by thermal spraying the structured powder onto a surface of a metallic substrate is disclosed. The structured powder has a metal core and is wholly...

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Hauptverfasser: WANG CONGHUA, GONTARZ, JR. GERALD A, ZHANG LIN
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Sprache:eng
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creator WANG CONGHUA
GONTARZ, JR. GERALD A
ZHANG LIN
description A method to use a novel structured metal-ceramic composite powder to improve the surface electrical conductivity of corrosion resistant metal substrates by thermal spraying the structured powder onto a surface of a metallic substrate is disclosed. The structured powder has a metal core and is wholly or partially surrounded by an electrically conductive ceramic material such as a metal nitride material. The metal cores may have the ceramic material formed on them prior to a thermal spraying process performed in an inert atmosphere, or the thermal spraying may be performed in a reactive atmosphere such that the ceramic coating forms on the cores during the thermal spraying process and/or after deposition. The metal cores will bond conductive ceramic material onto the surface of the substrate through the thermal spray process.
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GERALD A</creatorcontrib><creatorcontrib>ZHANG LIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG CONGHUA</au><au>GONTARZ, JR. GERALD A</au><au>ZHANG LIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HIGHLY ELECTRICALLY CONDUCTIVE SURFACES FOR ELECTROCHEMICAL APPLICATIONS AND METHODS TO PRODUCE SAME</title><date>2011-03-31</date><risdate>2011</risdate><abstract>A method to use a novel structured metal-ceramic composite powder to improve the surface electrical conductivity of corrosion resistant metal substrates by thermal spraying the structured powder onto a surface of a metallic substrate is disclosed. The structured powder has a metal core and is wholly or partially surrounded by an electrically conductive ceramic material such as a metal nitride material. The metal cores may have the ceramic material formed on them prior to a thermal spraying process performed in an inert atmosphere, or the thermal spraying may be performed in a reactive atmosphere such that the ceramic coating forms on the cores during the thermal spraying process and/or after deposition. The metal cores will bond conductive ceramic material onto the surface of the substrate through the thermal spray process.</abstract><oa>free_for_read</oa></addata></record>
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subjects APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
CASTING
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
METALLURGY
PERFORMING OPERATIONS
POWDER METALLURGY
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
SPRAYING OR ATOMISING IN GENERAL
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TRANSPORTING
WORKING METALLIC POWDER
title HIGHLY ELECTRICALLY CONDUCTIVE SURFACES FOR ELECTROCHEMICAL APPLICATIONS AND METHODS TO PRODUCE SAME
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