SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

The bonding time of a metallic ribbon is shortened in the semiconductor device which connects a lead frame with the bonding pad of a semiconductor chip with a metallic ribbon. The bottom of the wedge tool is divided into two by the V-groove at the first branch and the second branch. In order to do b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAMIMOTO HIDEAKI, SOBA TAKUMI, KUDO KAZUO, UEGURI TORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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