THERMAL CONDUCTIVE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Provided are a thermal conductive substrate having high thermal conductivity, which dissipates heat through as small as possible area thereof, and a method of manufacturing the thermal conductive substrate. The thermal conductive substrate includes a lower heat sink layer, a thermal conductive layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HAN CHUL JONG, KIM WON KEUN, CHO HUYN MIN, KWON SOON HYUNG
Format: Patent
Sprache:eng
Schlagworte:
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