THERMAL CONDUCTIVE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Provided are a thermal conductive substrate having high thermal conductivity, which dissipates heat through as small as possible area thereof, and a method of manufacturing the thermal conductive substrate. The thermal conductive substrate includes a lower heat sink layer, a thermal conductive layer...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HAN CHUL JONG, KIM WON KEUN, CHO HUYN MIN, KWON SOON HYUNG
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PUNCHING METAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WEAPONS WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are a thermal conductive substrate having high thermal conductivity, which dissipates heat through as small as possible area thereof, and a method of manufacturing the thermal conductive substrate. The thermal conductive substrate includes a lower heat sink layer, a thermal conductive layer including thermal conductors formed to contact the lower heat sink layer, and an insulating adhesive portion filled between the thermal conductors, and an upper layer formed on the thermal conductor, wherein the upper layer contacts the thermal conductor so as to dissipate heat to the lower heat sink layer.