LOAD LOCK APPARATUS AND SUBSTRATE COOLING METHOD
Disclosed are load lock apparatuses configured to cool a substrate efficiently. The load lock apparatus includes a container configured to change the pressure between an atmospheric pressure and a pressure corresponding to a transfer chamber which is in a vacuum state, a pressure adjusting mechanism...
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| creator | YAMAZAKI RYOJI |
| description | Disclosed are load lock apparatuses configured to cool a substrate efficiently. The load lock apparatus includes a container configured to change the pressure between an atmospheric pressure and a pressure corresponding to a transfer chamber which is in a vacuum state, a pressure adjusting mechanism configured to adjust the pressure in container to the pressure corresponding to transfer chamber and an atmospheric pressure. The load lock apparatus further includes an upper cooling plate and a lower cooling plate provided opposed to each other inside container and each configured to cool the wafer at a position adjacent to the wafer or in touch with the wafer, and a wafer elevating pin and a driving mechanism that transfer the wafer to the cooling position of lower cooling plate. The load lock apparatus also includes a wafer supporting member and driving mechanism that transfer the wafer W to the cooling position of upper cooling plate. |
| format | Patent |
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The load lock apparatus includes a container configured to change the pressure between an atmospheric pressure and a pressure corresponding to a transfer chamber which is in a vacuum state, a pressure adjusting mechanism configured to adjust the pressure in container to the pressure corresponding to transfer chamber and an atmospheric pressure. The load lock apparatus further includes an upper cooling plate and a lower cooling plate provided opposed to each other inside container and each configured to cool the wafer at a position adjacent to the wafer or in touch with the wafer, and a wafer elevating pin and a driving mechanism that transfer the wafer to the cooling position of lower cooling plate. The load lock apparatus also includes a wafer supporting member and driving mechanism that transfer the wafer W to the cooling position of upper cooling plate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; COLD ROOMS ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT PUMP SYSTEMS ; HEATING ; ICE-BOXES ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; REFRIGERATION OR COOLING ; REFRIGERATORS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110106&DB=EPODOC&CC=US&NR=2011000232A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110106&DB=EPODOC&CC=US&NR=2011000232A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAZAKI RYOJI</creatorcontrib><title>LOAD LOCK APPARATUS AND SUBSTRATE COOLING METHOD</title><description>Disclosed are load lock apparatuses configured to cool a substrate efficiently. 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The load lock apparatus also includes a wafer supporting member and driving mechanism that transfer the wafer W to the cooling position of upper cooling plate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>COLD ROOMS</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEATING</subject><subject>ICE-BOXES</subject><subject>LIGHTING</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MECHANICAL ENGINEERING</subject><subject>REFRIGERATION OR COOLING</subject><subject>REFRIGERATORS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDw8Xd0UfDxd_ZWcAwIcAxyDAkNVnD0c1EIDnUKDgFyXRWc_f19PP3cFXxdQzz8XXgYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXxosJGBoaGBgYGRsZGjoTFxqgC1Uyb3</recordid><startdate>20110106</startdate><enddate>20110106</enddate><creator>YAMAZAKI RYOJI</creator><scope>EVB</scope></search><sort><creationdate>20110106</creationdate><title>LOAD LOCK APPARATUS AND SUBSTRATE COOLING METHOD</title><author>YAMAZAKI RYOJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2011000232A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>COLD ROOMS</topic><topic>COMBINED HEATING AND REFRIGERATION SYSTEMS</topic><topic>COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT PUMP SYSTEMS</topic><topic>HEATING</topic><topic>ICE-BOXES</topic><topic>LIGHTING</topic><topic>LIQUEFACTION SOLIDIFICATION OF GASES</topic><topic>MANUFACTURE OR STORAGE OF ICE</topic><topic>MECHANICAL ENGINEERING</topic><topic>REFRIGERATION OR COOLING</topic><topic>REFRIGERATORS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAZAKI RYOJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAZAKI RYOJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LOAD LOCK APPARATUS AND SUBSTRATE COOLING METHOD</title><date>2011-01-06</date><risdate>2011</risdate><abstract>Disclosed are load lock apparatuses configured to cool a substrate efficiently. The load lock apparatus includes a container configured to change the pressure between an atmospheric pressure and a pressure corresponding to a transfer chamber which is in a vacuum state, a pressure adjusting mechanism configured to adjust the pressure in container to the pressure corresponding to transfer chamber and an atmospheric pressure. The load lock apparatus further includes an upper cooling plate and a lower cooling plate provided opposed to each other inside container and each configured to cool the wafer at a position adjacent to the wafer or in touch with the wafer, and a wafer elevating pin and a driving mechanism that transfer the wafer to the cooling position of lower cooling plate. The load lock apparatus also includes a wafer supporting member and driving mechanism that transfer the wafer W to the cooling position of upper cooling plate.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_US2011000232A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS BLASTING COLD ROOMS COMBINED HEATING AND REFRIGERATION SYSTEMS COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING ICE-BOXES LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION OR COOLING REFRIGERATORS SEMICONDUCTOR DEVICES WEAPONS |
| title | LOAD LOCK APPARATUS AND SUBSTRATE COOLING METHOD |
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