METHOD FOR CONNECTING A DIE ATTACH PAD TO A LEAD FRAME AND PRODUCT THEREOF

METHOD FOR CONNECTING A DIE ATTACH PAD TO A LEAD FRAME AND PRODUCT THEREOF

Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GRANADA, JR. HONORIO T, ALMAGRO ERWIN IAN V, CALO PAUL ARMAND
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.