Tape carrier package, individual tape carrier package product, and method of manufacturing the same

A tape carrier package includes: a tape base; and interconnections formed on the tape base and extending to intersect a cutting line. At least a slit is formed along each of the interconnections, to intersect the cutting line and to divide the interconnection into a plurality of interconnection elem...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: YOSHINO ISAO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YOSHINO ISAO
description A tape carrier package includes: a tape base; and interconnections formed on the tape base and extending to intersect a cutting line. At least a slit is formed along each of the interconnections, to intersect the cutting line and to divide the interconnection into a plurality of interconnection elements.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2010295045A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2010295045A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2010295045A13</originalsourceid><addsrcrecordid>eNqNzL0KwjAUQOEsDlJ9hwuuFdJqB0cpirt1Lpfkpg02PyQ3Pr8Ojg5OZ_k4a6EGjAQKU7KUIKJ64kQ1WK_ty-qCC_APADEFXRTXgF6DI56DhmDAoS8GFZdk_QQ8E2R0tBErg0um7beV2F0vQ3_bUwwj5c-TPPH4uLeyke2pk8fu3Bz-U29EiD7Y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Tape carrier package, individual tape carrier package product, and method of manufacturing the same</title><source>esp@cenet</source><creator>YOSHINO ISAO</creator><creatorcontrib>YOSHINO ISAO</creatorcontrib><description>A tape carrier package includes: a tape base; and interconnections formed on the tape base and extending to intersect a cutting line. At least a slit is formed along each of the interconnections, to intersect the cutting line and to divide the interconnection into a plurality of interconnection elements.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20101125&amp;DB=EPODOC&amp;CC=US&amp;NR=2010295045A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20101125&amp;DB=EPODOC&amp;CC=US&amp;NR=2010295045A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOSHINO ISAO</creatorcontrib><title>Tape carrier package, individual tape carrier package product, and method of manufacturing the same</title><description>A tape carrier package includes: a tape base; and interconnections formed on the tape base and extending to intersect a cutting line. At least a slit is formed along each of the interconnections, to intersect the cutting line and to divide the interconnection into a plurality of interconnection elements.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzL0KwjAUQOEsDlJ9hwuuFdJqB0cpirt1Lpfkpg02PyQ3Pr8Ojg5OZ_k4a6EGjAQKU7KUIKJ64kQ1WK_ty-qCC_APADEFXRTXgF6DI56DhmDAoS8GFZdk_QQ8E2R0tBErg0um7beV2F0vQ3_bUwwj5c-TPPH4uLeyke2pk8fu3Bz-U29EiD7Y</recordid><startdate>20101125</startdate><enddate>20101125</enddate><creator>YOSHINO ISAO</creator><scope>EVB</scope></search><sort><creationdate>20101125</creationdate><title>Tape carrier package, individual tape carrier package product, and method of manufacturing the same</title><author>YOSHINO ISAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2010295045A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YOSHINO ISAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOSHINO ISAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Tape carrier package, individual tape carrier package product, and method of manufacturing the same</title><date>2010-11-25</date><risdate>2010</risdate><abstract>A tape carrier package includes: a tape base; and interconnections formed on the tape base and extending to intersect a cutting line. At least a slit is formed along each of the interconnections, to intersect the cutting line and to divide the interconnection into a plurality of interconnection elements.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2010295045A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Tape carrier package, individual tape carrier package product, and method of manufacturing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T18%3A04%3A16IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YOSHINO%20ISAO&rft.date=2010-11-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2010295045A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true