Universal Inter-Layer Interconnect for Multi-Layer Semiconductor Stacks

A circuit arrangement and method utilize a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor sta...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VANDERWIEL STEVEN PAUL, JOHNSON CHARLES LUTHER, VAREKAMP PATRICK RONALD, BARTLEY GERALD K, HOOVER RUSSELL DEAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
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