System and method for design, procurement and manufacturing collaboration

A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated...

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Hauptverfasser: BOMMAKANTI RAM GOPAL, GANAPATHY VISVANATHAN, BURNS PAUL N, MADDOX DOUGLAS EDWARD, BRATHWAITE NICHOLAS E, DURKAN MICHAEL ANTHONY
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creator BOMMAKANTI RAM GOPAL
GANAPATHY VISVANATHAN
BURNS PAUL N
MADDOX DOUGLAS EDWARD
BRATHWAITE NICHOLAS E
DURKAN MICHAEL ANTHONY
description A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated with the corresponding devices, presenting the devices to the designer based on the procurement data, and receiving input from the designer identifying one of the presented devices as a selected device. In a particular method, the returned devices are sorted based on one or more procurement values (e.g., manufacturer, price, availability, manufacturer status, etc.), and presented to the designer in a ranked list. Objects representative of the selected devices are then entered into a design file, and the objects are associated with the device's engineering and/or procurement data. In a particular embodiment, the objects are associated with the engineering data by embedding the engineering data in the file object. Optionally, data can be associated with the objects via links to the database. Types of engineering data that can be associated with design file objects include, but are not limited to, device footprint data, device pinout data, device physical dimension data, parametric data, and packaging data. Additionally, connection data and annotation data can be entered into the design file objects by the designer.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2010242005A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2010242005A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2010242005A13</originalsourceid><addsrcrecordid>eNqNyjsKAjEQANA0FqLeYcBWIRv1ACKK1qv1MmYnayCZCfkU3t5CD2D1mjdXt_5dKkVAHiFSfckITjKMVPzEG0hZbMsUieu3IDeHtrbseQIrIeBTMlYvvFQzh6HQ6udCrS_n--m6pSQDlYSWmOrw6I3utNkbrQ_Hbvff-gDXrTXu</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>System and method for design, procurement and manufacturing collaboration</title><source>esp@cenet</source><creator>BOMMAKANTI RAM GOPAL ; GANAPATHY VISVANATHAN ; BURNS PAUL N ; MADDOX DOUGLAS EDWARD ; BRATHWAITE NICHOLAS E ; DURKAN MICHAEL ANTHONY</creator><creatorcontrib>BOMMAKANTI RAM GOPAL ; GANAPATHY VISVANATHAN ; BURNS PAUL N ; MADDOX DOUGLAS EDWARD ; BRATHWAITE NICHOLAS E ; DURKAN MICHAEL ANTHONY</creatorcontrib><description>A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated with the corresponding devices, presenting the devices to the designer based on the procurement data, and receiving input from the designer identifying one of the presented devices as a selected device. In a particular method, the returned devices are sorted based on one or more procurement values (e.g., manufacturer, price, availability, manufacturer status, etc.), and presented to the designer in a ranked list. Objects representative of the selected devices are then entered into a design file, and the objects are associated with the device's engineering and/or procurement data. In a particular embodiment, the objects are associated with the engineering data by embedding the engineering data in the file object. Optionally, data can be associated with the objects via links to the database. Types of engineering data that can be associated with design file objects include, but are not limited to, device footprint data, device pinout data, device physical dimension data, parametric data, and packaging data. Additionally, connection data and annotation data can be entered into the design file objects by the designer.</description><language>eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS ; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100923&amp;DB=EPODOC&amp;CC=US&amp;NR=2010242005A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100923&amp;DB=EPODOC&amp;CC=US&amp;NR=2010242005A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BOMMAKANTI RAM GOPAL</creatorcontrib><creatorcontrib>GANAPATHY VISVANATHAN</creatorcontrib><creatorcontrib>BURNS PAUL N</creatorcontrib><creatorcontrib>MADDOX DOUGLAS EDWARD</creatorcontrib><creatorcontrib>BRATHWAITE NICHOLAS E</creatorcontrib><creatorcontrib>DURKAN MICHAEL ANTHONY</creatorcontrib><title>System and method for design, procurement and manufacturing collaboration</title><description>A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated with the corresponding devices, presenting the devices to the designer based on the procurement data, and receiving input from the designer identifying one of the presented devices as a selected device. In a particular method, the returned devices are sorted based on one or more procurement values (e.g., manufacturer, price, availability, manufacturer status, etc.), and presented to the designer in a ranked list. Objects representative of the selected devices are then entered into a design file, and the objects are associated with the device's engineering and/or procurement data. In a particular embodiment, the objects are associated with the engineering data by embedding the engineering data in the file object. Optionally, data can be associated with the objects via links to the database. Types of engineering data that can be associated with design file objects include, but are not limited to, device footprint data, device pinout data, device physical dimension data, parametric data, and packaging data. Additionally, connection data and annotation data can be entered into the design file objects by the designer.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><subject>SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjsKAjEQANA0FqLeYcBWIRv1ACKK1qv1MmYnayCZCfkU3t5CD2D1mjdXt_5dKkVAHiFSfckITjKMVPzEG0hZbMsUieu3IDeHtrbseQIrIeBTMlYvvFQzh6HQ6udCrS_n--m6pSQDlYSWmOrw6I3utNkbrQ_Hbvff-gDXrTXu</recordid><startdate>20100923</startdate><enddate>20100923</enddate><creator>BOMMAKANTI RAM GOPAL</creator><creator>GANAPATHY VISVANATHAN</creator><creator>BURNS PAUL N</creator><creator>MADDOX DOUGLAS EDWARD</creator><creator>BRATHWAITE NICHOLAS E</creator><creator>DURKAN MICHAEL ANTHONY</creator><scope>EVB</scope></search><sort><creationdate>20100923</creationdate><title>System and method for design, procurement and manufacturing collaboration</title><author>BOMMAKANTI RAM GOPAL ; GANAPATHY VISVANATHAN ; BURNS PAUL N ; MADDOX DOUGLAS EDWARD ; BRATHWAITE NICHOLAS E ; DURKAN MICHAEL ANTHONY</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2010242005A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><topic>SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>BOMMAKANTI RAM GOPAL</creatorcontrib><creatorcontrib>GANAPATHY VISVANATHAN</creatorcontrib><creatorcontrib>BURNS PAUL N</creatorcontrib><creatorcontrib>MADDOX DOUGLAS EDWARD</creatorcontrib><creatorcontrib>BRATHWAITE NICHOLAS E</creatorcontrib><creatorcontrib>DURKAN MICHAEL ANTHONY</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BOMMAKANTI RAM GOPAL</au><au>GANAPATHY VISVANATHAN</au><au>BURNS PAUL N</au><au>MADDOX DOUGLAS EDWARD</au><au>BRATHWAITE NICHOLAS E</au><au>DURKAN MICHAEL ANTHONY</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>System and method for design, procurement and manufacturing collaboration</title><date>2010-09-23</date><risdate>2010</risdate><abstract>A method for designing an electronic component includes receiving a device criteria (e.g., a parametric value, procurement value, etc.) from a designer, querying a database for devices corresponding to the device criteria, querying the database for procurement data and/or engineering data associated with the corresponding devices, presenting the devices to the designer based on the procurement data, and receiving input from the designer identifying one of the presented devices as a selected device. In a particular method, the returned devices are sorted based on one or more procurement values (e.g., manufacturer, price, availability, manufacturer status, etc.), and presented to the designer in a ranked list. Objects representative of the selected devices are then entered into a design file, and the objects are associated with the device's engineering and/or procurement data. In a particular embodiment, the objects are associated with the engineering data by embedding the engineering data in the file object. Optionally, data can be associated with the objects via links to the database. Types of engineering data that can be associated with design file objects include, but are not limited to, device footprint data, device pinout data, device physical dimension data, parametric data, and packaging data. Additionally, connection data and annotation data can be entered into the design file objects by the designer.</abstract><oa>free_for_read</oa></addata></record>
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recordid cdi_epo_espacenet_US2010242005A1
source esp@cenet
subjects CALCULATING
COMPUTING
COUNTING
DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR
title System and method for design, procurement and manufacturing collaboration
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T07%3A31%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BOMMAKANTI%20RAM%20GOPAL&rft.date=2010-09-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2010242005A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true