SEALING STRUCTURE

To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to...

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Hauptverfasser: MIYAJIMA KEIICHI, HAYASHI TAKAHIRO, HORA MAKOTO
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creator MIYAJIMA KEIICHI
HAYASHI TAKAHIRO
HORA MAKOTO
description To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2010212953A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2010212953A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2010212953A13</originalsourceid><addsrcrecordid>eNrjZBAMdnX08fRzVwgOCQp1DgkNcuVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhgZGhkaWpsaOhsbEqQIApZAe0g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SEALING STRUCTURE</title><source>esp@cenet</source><creator>MIYAJIMA KEIICHI ; HAYASHI TAKAHIRO ; HORA MAKOTO</creator><creatorcontrib>MIYAJIMA KEIICHI ; HAYASHI TAKAHIRO ; HORA MAKOTO</creatorcontrib><description>To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100826&amp;DB=EPODOC&amp;CC=US&amp;NR=2010212953A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100826&amp;DB=EPODOC&amp;CC=US&amp;NR=2010212953A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIYAJIMA KEIICHI</creatorcontrib><creatorcontrib>HAYASHI TAKAHIRO</creatorcontrib><creatorcontrib>HORA MAKOTO</creatorcontrib><title>SEALING STRUCTURE</title><description>To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAMdnX08fRzVwgOCQp1DgkNcuVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhgZGhkaWpsaOhsbEqQIApZAe0g</recordid><startdate>20100826</startdate><enddate>20100826</enddate><creator>MIYAJIMA KEIICHI</creator><creator>HAYASHI TAKAHIRO</creator><creator>HORA MAKOTO</creator><scope>EVB</scope></search><sort><creationdate>20100826</creationdate><title>SEALING STRUCTURE</title><author>MIYAJIMA KEIICHI ; HAYASHI TAKAHIRO ; HORA MAKOTO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2010212953A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MIYAJIMA KEIICHI</creatorcontrib><creatorcontrib>HAYASHI TAKAHIRO</creatorcontrib><creatorcontrib>HORA MAKOTO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIYAJIMA KEIICHI</au><au>HAYASHI TAKAHIRO</au><au>HORA MAKOTO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEALING STRUCTURE</title><date>2010-08-26</date><risdate>2010</risdate><abstract>To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SEALING STRUCTURE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T08%3A59%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MIYAJIMA%20KEIICHI&rft.date=2010-08-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2010212953A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true