COMPONENT PACKAGE FOR MAINTAINING SAFE OPERATING TEMPERATURE OF COMPONENTS

A thermally insulated electronic component package and an instrument suitable for process conditions in a high temperature environment are disclosed. The component package includes a thin electronic component, a thermally insulating outer enclosure, and an insert made of a thermally insulating mater...

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Bibliographische Detailangaben
Hauptverfasser: CHAMPAGNE PASCAL, SUN MEI
Format: Patent
Sprache:eng
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