Semiconductor Dice with Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using the Same, and Methods of Making the Same

Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	GRUENHAGEN MICHAEL D, TJHIA EDDY, DOLAN DOUGLAS E, MURPHY JAMES J, WU CHUNG-LIN, KIM SUKU, LARSEN MARK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	GRUENHAGEN MICHAEL D TJHIA EDDY DOLAN DOUGLAS E MURPHY JAMES J WU CHUNG-LIN KIM SUKU LARSEN MARK
description	Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2010148325A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2010148325A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2010148325A13</originalsourceid><addsrcrecordid>eNqNjL0KwjAURrs4iPoOF1wrWH_Atf4UHQShLY7lktw2wTQpzVUfxdc1goOj0zecc75h9Mqp1cJZeRfsethrQfDUrGCL4ua1JCh6skKRh0wbQxKuH3ow6FkLOCNTr9FAFuJT2_XuEZSUGYVqyXIMl_CDTchLr20DrAhybCkGtBLOxMpJD64OT7dfPo4GNRpPk--Ooml2KHbHGXWuIt-hIEtclflinsyT1Wa5WKfJ8j_rDf0qUHw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor Dice with Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using the Same, and Methods of Making the Same</title><source>esp@cenet</source><creator>GRUENHAGEN MICHAEL D ; TJHIA EDDY ; DOLAN DOUGLAS E ; MURPHY JAMES J ; WU CHUNG-LIN ; KIM SUKU ; LARSEN MARK</creator><creatorcontrib>GRUENHAGEN MICHAEL D ; TJHIA EDDY ; DOLAN DOUGLAS E ; MURPHY JAMES J ; WU CHUNG-LIN ; KIM SUKU ; LARSEN MARK</creatorcontrib><description>Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100617&DB=EPODOC&CC=US&NR=2010148325A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100617&DB=EPODOC&CC=US&NR=2010148325A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GRUENHAGEN MICHAEL D</creatorcontrib><creatorcontrib>TJHIA EDDY</creatorcontrib><creatorcontrib>DOLAN DOUGLAS E</creatorcontrib><creatorcontrib>MURPHY JAMES J</creatorcontrib><creatorcontrib>WU CHUNG-LIN</creatorcontrib><creatorcontrib>KIM SUKU</creatorcontrib><creatorcontrib>LARSEN MARK</creatorcontrib><title>Semiconductor Dice with Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using the Same, and Methods of Making the Same</title><description>Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjL0KwjAURrs4iPoOF1wrWH_Atf4UHQShLY7lktw2wTQpzVUfxdc1goOj0zecc75h9Mqp1cJZeRfsethrQfDUrGCL4ua1JCh6skKRh0wbQxKuH3ow6FkLOCNTr9FAFuJT2_XuEZSUGYVqyXIMl_CDTchLr20DrAhybCkGtBLOxMpJD64OT7dfPo4GNRpPk--Ooml2KHbHGXWuIt-hIEtclflinsyT1Wa5WKfJ8j_rDf0qUHw</recordid><startdate>20100617</startdate><enddate>20100617</enddate><creator>GRUENHAGEN MICHAEL D</creator><creator>TJHIA EDDY</creator><creator>DOLAN DOUGLAS E</creator><creator>MURPHY JAMES J</creator><creator>WU CHUNG-LIN</creator><creator>KIM SUKU</creator><creator>LARSEN MARK</creator><scope>EVB</scope></search><sort><creationdate>20100617</creationdate><title>Semiconductor Dice with Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using the Same, and Methods of Making the Same</title><author>GRUENHAGEN MICHAEL D ; TJHIA EDDY ; DOLAN DOUGLAS E ; MURPHY JAMES J ; WU CHUNG-LIN ; KIM SUKU ; LARSEN MARK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2010148325A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>GRUENHAGEN MICHAEL D</creatorcontrib><creatorcontrib>TJHIA EDDY</creatorcontrib><creatorcontrib>DOLAN DOUGLAS E</creatorcontrib><creatorcontrib>MURPHY JAMES J</creatorcontrib><creatorcontrib>WU CHUNG-LIN</creatorcontrib><creatorcontrib>KIM SUKU</creatorcontrib><creatorcontrib>LARSEN MARK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GRUENHAGEN MICHAEL D</au><au>TJHIA EDDY</au><au>DOLAN DOUGLAS E</au><au>MURPHY JAMES J</au><au>WU CHUNG-LIN</au><au>KIM SUKU</au><au>LARSEN MARK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor Dice with Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using the Same, and Methods of Making the Same</title><date>2010-06-17</date><risdate>2010</risdate><abstract>Disclosed are semiconductor dice with backside trenches filled with elastic conductive material. The trenches reduce the on-state resistances of the devices incorporated on the dice. The elastic conductive material provides a conductive path to the backsides of the die with little induced stress on the semiconductor die caused by thermal cycling. Also disclosed are packages using the dice, and methods of making the dice.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US2010148325A1
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	Semiconductor Dice with Backside Trenches Filled With Elastic Material For Improved Attachment, Packages Using the Same, and Methods of Making the Same
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T21%3A49%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GRUENHAGEN%20MICHAEL%20D&rft.date=2010-06-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2010148325A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true