MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS

MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS

A microarray package includes a leadframe having an array of contact posts, a die carried by the lead frame, and a plurality of bonding wires that electrically connect the die to the lead frame. An encapsulant is included that encapsulates the die, the bonding wire and the leadframe while leaving th...

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Hauptverfasser: TU NGHIA T, BAYAN JAIME
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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BAYAN JAIME
description A microarray package includes a leadframe having an array of contact posts, a die carried by the lead frame, and a plurality of bonding wires that electrically connect the die to the lead frame. An encapsulant is included that encapsulates the die, the bonding wire and the leadframe while leaving the distal ends of the contact posts exposed and substantially co-planar with a bottom surface of the microarray package. A plurality of pedestal members is plated to the distal end of a respective contact pad. A distal surface of each pedestal member protrudes outwardly beyond the bottom surface of the microarray package in the range of about 15 μm to about 35 μm.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MICROARRAY PACKAGE WITH PLATED CONTACT PEDESTALS
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