SHRINK PACKAGE ON BOARD

A method of forming a device is disclosed. The method includes providing a printed circuit board substrate having a die attach region on a first surface of the substrate. The method also includes attaching a die to a die attach region. The die is electrically coupled to first land pads disposed on t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MANALAC RODEL, ENG KIAN TENG, GAN RICHARD TE, PARK TECK WAH
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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