CIRCUIT DEVICE

Provided is a circuit device having a configuration in which thermal interference between built-in elements is suppressed and being miniaturized in total size. A hybrid integrated circuit device of the present invention includes: a circuit substrate, a sealing resin and leads. The circuit substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIBASAKI TAKASHI, YAMAMOTO TETSUYA, KUDO KIYOAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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