Integrated Circuit Devices with Stacked Package Interposers

An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the d...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PENG NEO CHEE, MICHAEL TAN KIAN SHING, CHUAN TAN HOCK, CHYE CHEW BENG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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