VERTICAL CURRENT TRANSPORT IN A POWER CONVERTER CIRCUIT
In at least one embodiment of the invention, an apparatus includes an integrated circuit comprising a power stage portion of a power converter circuit. The power stage portion includes a first switch circuit portion formed by a first plurality of lateral devices in a first substrate. The power stage...
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creator | AZRAI FIRAS |
description | In at least one embodiment of the invention, an apparatus includes an integrated circuit comprising a power stage portion of a power converter circuit. The power stage portion includes a first switch circuit portion formed by a first plurality of lateral devices in a first substrate. The power stage portion includes a second switch circuit portion formed by a second plurality of lateral devices in the first substrate. The integrated circuit includes a multi-layer current routing structure configured to transport a first current between the first plurality of lateral devices and an array of conductor structures on the surface of the integrated circuit using a first substantially vertical conduction path when the first switch circuit portion is enabled. The multi-layer current routing structure is configured to transport a second current between the second plurality of lateral devices and the array of conductor structures using a second substantially vertical conduction path when the second switch portion is enabled. |
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The power stage portion includes a first switch circuit portion formed by a first plurality of lateral devices in a first substrate. The power stage portion includes a second switch circuit portion formed by a second plurality of lateral devices in the first substrate. The integrated circuit includes a multi-layer current routing structure configured to transport a first current between the first plurality of lateral devices and an array of conductor structures on the surface of the integrated circuit using a first substantially vertical conduction path when the first switch circuit portion is enabled. The multi-layer current routing structure is configured to transport a second current between the second plurality of lateral devices and the array of conductor structures using a second substantially vertical conduction path when the second switch portion is enabled.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100311&DB=EPODOC&CC=US&NR=2010059795A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100311&DB=EPODOC&CC=US&NR=2010059795A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AZRAI FIRAS</creatorcontrib><title>VERTICAL CURRENT TRANSPORT IN A POWER CONVERTER CIRCUIT</title><description>In at least one embodiment of the invention, an apparatus includes an integrated circuit comprising a power stage portion of a power converter circuit. The power stage portion includes a first switch circuit portion formed by a first plurality of lateral devices in a first substrate. The power stage portion includes a second switch circuit portion formed by a second plurality of lateral devices in the first substrate. The integrated circuit includes a multi-layer current routing structure configured to transport a first current between the first plurality of lateral devices and an array of conductor structures on the surface of the integrated circuit using a first substantially vertical conduction path when the first switch circuit portion is enabled. The multi-layer current routing structure is configured to transport a second current between the second plurality of lateral devices and the array of conductor structures using a second substantially vertical conduction path when the second switch portion is enabled.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAPcw0K8XR29FFwDg0KcvULUQgJcvQLDvAPClHw9FNwVAjwD3cNUnD29wMpBLE8g5xDPUN4GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgaGBgamluaWpo6ExcaoAAe0peA</recordid><startdate>20100311</startdate><enddate>20100311</enddate><creator>AZRAI FIRAS</creator><scope>EVB</scope></search><sort><creationdate>20100311</creationdate><title>VERTICAL CURRENT TRANSPORT IN A POWER CONVERTER CIRCUIT</title><author>AZRAI FIRAS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2010059795A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>AZRAI FIRAS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AZRAI FIRAS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VERTICAL CURRENT TRANSPORT IN A POWER CONVERTER CIRCUIT</title><date>2010-03-11</date><risdate>2010</risdate><abstract>In at least one embodiment of the invention, an apparatus includes an integrated circuit comprising a power stage portion of a power converter circuit. The power stage portion includes a first switch circuit portion formed by a first plurality of lateral devices in a first substrate. The power stage portion includes a second switch circuit portion formed by a second plurality of lateral devices in the first substrate. The integrated circuit includes a multi-layer current routing structure configured to transport a first current between the first plurality of lateral devices and an array of conductor structures on the surface of the integrated circuit using a first substantially vertical conduction path when the first switch circuit portion is enabled. The multi-layer current routing structure is configured to transport a second current between the second plurality of lateral devices and the array of conductor structures using a second substantially vertical conduction path when the second switch portion is enabled.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | VERTICAL CURRENT TRANSPORT IN A POWER CONVERTER CIRCUIT |
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