Semiconductor package

Semiconductor package

Provided is a semiconductor package including a first substrate including a first substrate pad and a second substrate pad spaced apart from each other, first semiconductor chips stacked on the first substrate and having a first side surface and a second side surface, first chip pads disposed on the...

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Hauptverfasser: BAEK JOONGHYUN, IM SUNGJUN, LEE HEEJIN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator BAEK JOONGHYUN
IM SUNGJUN
LEE HEEJIN
description Provided is a semiconductor package including a first substrate including a first substrate pad and a second substrate pad spaced apart from each other, first semiconductor chips stacked on the first substrate and having a first side surface and a second side surface, first chip pads disposed on the first substrate pad and adjacent to the first side surface and provided to the respective first semiconductor chips in the peripheral circuit region and electrically connected to the first substrate pad, and a second semiconductor chip disposed toward the second side surface and including a second chip pad spaced apart from the first chip pad and electrically connected to the second substrate pad, and a heat insulation member provided to the first substrate between the at least one first substrate pad and the at least one second substrate pad.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor package
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