COMPOSITION FOR REMOVING RESIDUE FROM WIRING BOARD AND CLEANING METHOD
A composition for removing a residue from a wiring board containing an oxidizing agent and an azole compound and having a pH of from 1 to 7 and a cleaning method of a wiring board for removing a residue after dry etching by using this composition are provided. By using the composition for removing a...
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| creator | KASHIWAGI HIDEO KUWABARA EIKO MATSUNAGA HIROSHI OHTO MASARU |
| description | A composition for removing a residue from a wiring board containing an oxidizing agent and an azole compound and having a pH of from 1 to 7 and a cleaning method of a wiring board for removing a residue after dry etching by using this composition are provided. By using the composition for removing a residue of the present invention, in manufacturing a wiring board, residues remaining after dry etching which are derived from a resist or metals can be effectively removed without corroding titanium or titanium alloys with high corrosiveness. In particular, a semiconductor device using a wiring board containing titanium or titanium alloys can be efficiently manufactured. |
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By using the composition for removing a residue of the present invention, in manufacturing a wiring board, residues remaining after dry etching which are derived from a resist or metals can be effectively removed without corroding titanium or titanium alloys with high corrosiveness. In particular, a semiconductor device using a wiring board containing titanium or titanium alloys can be efficiently manufactured.</description><language>eng</language><subject>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES ; CANDLES ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DETERGENT COMPOSITIONS ; DETERGENTS ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; FATTY ACIDS THEREFROM ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; RECOVERY OF GLYCEROL ; RESIN SOAPS ; SOAP OR SOAP-MAKING ; USE OF SINGLE SUBSTANCES AS DETERGENTS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100304&DB=EPODOC&CC=US&NR=2010051066A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100304&DB=EPODOC&CC=US&NR=2010051066A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KASHIWAGI HIDEO</creatorcontrib><creatorcontrib>KUWABARA EIKO</creatorcontrib><creatorcontrib>MATSUNAGA HIROSHI</creatorcontrib><creatorcontrib>OHTO MASARU</creatorcontrib><title>COMPOSITION FOR REMOVING RESIDUE FROM WIRING BOARD AND CLEANING METHOD</title><description>A composition for removing a residue from a wiring board containing an oxidizing agent and an azole compound and having a pH of from 1 to 7 and a cleaning method of a wiring board for removing a residue after dry etching by using this composition are provided. By using the composition for removing a residue of the present invention, in manufacturing a wiring board, residues remaining after dry etching which are derived from a resist or metals can be effectively removed without corroding titanium or titanium alloys with high corrosiveness. In particular, a semiconductor device using a wiring board containing titanium or titanium alloys can be efficiently manufactured.</description><subject>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES</subject><subject>CANDLES</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DETERGENT COMPOSITIONS</subject><subject>DETERGENTS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>FATTY ACIDS THEREFROM</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>RECOVERY OF GLYCEROL</subject><subject>RESIN SOAPS</subject><subject>SOAP OR SOAP-MAKING</subject><subject>USE OF SINGLE SUBSTANCES AS DETERGENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBz9vcN8A_2DPH091Nw8w9SCHL19Q_z9HMHMoI9XUJdFdyC_H0Vwj2DQGJO_o5BLgqOfi4Kzj6ujn4gIV_XEA9_Fx4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEh8abGRgaGBgamhgZuZoaEycKgBlAS0f</recordid><startdate>20100304</startdate><enddate>20100304</enddate><creator>KASHIWAGI HIDEO</creator><creator>KUWABARA EIKO</creator><creator>MATSUNAGA HIROSHI</creator><creator>OHTO MASARU</creator><scope>EVB</scope></search><sort><creationdate>20100304</creationdate><title>COMPOSITION FOR REMOVING RESIDUE FROM WIRING BOARD AND CLEANING METHOD</title><author>KASHIWAGI HIDEO ; KUWABARA EIKO ; MATSUNAGA HIROSHI ; OHTO MASARU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2010051066A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES</topic><topic>CANDLES</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DETERGENT COMPOSITIONS</topic><topic>DETERGENTS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>FATTY ACIDS THEREFROM</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>RECOVERY OF GLYCEROL</topic><topic>RESIN SOAPS</topic><topic>SOAP OR SOAP-MAKING</topic><topic>USE OF SINGLE SUBSTANCES AS DETERGENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>KASHIWAGI HIDEO</creatorcontrib><creatorcontrib>KUWABARA EIKO</creatorcontrib><creatorcontrib>MATSUNAGA HIROSHI</creatorcontrib><creatorcontrib>OHTO MASARU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KASHIWAGI HIDEO</au><au>KUWABARA EIKO</au><au>MATSUNAGA HIROSHI</au><au>OHTO MASARU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPOSITION FOR REMOVING RESIDUE FROM WIRING BOARD AND CLEANING METHOD</title><date>2010-03-04</date><risdate>2010</risdate><abstract>A composition for removing a residue from a wiring board containing an oxidizing agent and an azole compound and having a pH of from 1 to 7 and a cleaning method of a wiring board for removing a residue after dry etching by using this composition are provided. By using the composition for removing a residue of the present invention, in manufacturing a wiring board, residues remaining after dry etching which are derived from a resist or metals can be effectively removed without corroding titanium or titanium alloys with high corrosiveness. In particular, a semiconductor device using a wiring board containing titanium or titanium alloys can be efficiently manufactured.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES CANDLES CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DETERGENT COMPOSITIONS DETERGENTS DIFFUSION TREATMENT OF METALLIC MATERIAL FATTY ACIDS THEREFROM INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS |
| title | COMPOSITION FOR REMOVING RESIDUE FROM WIRING BOARD AND CLEANING METHOD |
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