Method for Packaging Components

The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover su...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WOELFING BERND, AUCHTER-KRUMMEL PETRA, MUND DIETRICH, PAWLOWSKI EDGAR, BIERTUEMPFEL RALF, BRAUNECK ULF, HAYDEN JOSEPH S, FOTHERINGHAM ULRICH, SEIDEMANN VOLKER, FLEISSNER FRANK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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