Method for Packaging Components

Method for Packaging Components

The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover su...

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Hauptverfasser: WOELFING BERND, AUCHTER-KRUMMEL PETRA, MUND DIETRICH, PAWLOWSKI EDGAR, BIERTUEMPFEL RALF, BRAUNECK ULF, HAYDEN JOSEPH S, FOTHERINGHAM ULRICH, SEIDEMANN VOLKER, FLEISSNER FRANK
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator WOELFING BERND
AUCHTER-KRUMMEL PETRA
MUND DIETRICH
PAWLOWSKI EDGAR
BIERTUEMPFEL RALF
BRAUNECK ULF
HAYDEN JOSEPH S
FOTHERINGHAM ULRICH
SEIDEMANN VOLKER
FLEISSNER FRANK
description The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2010022053A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2010022053A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2010022053A13</originalsourceid><addsrcrecordid>eNrjZJD3TS3JyE9RSMsvUghITM5OTM_MS1dwzs8tyM9LzSsp5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGBgZGRgamxo6GxsSpAgCinyWL</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for Packaging Components</title><source>esp@cenet</source><creator>WOELFING BERND ; AUCHTER-KRUMMEL PETRA ; MUND DIETRICH ; PAWLOWSKI EDGAR ; BIERTUEMPFEL RALF ; BRAUNECK ULF ; HAYDEN JOSEPH S ; FOTHERINGHAM ULRICH ; SEIDEMANN VOLKER ; FLEISSNER FRANK</creator><creatorcontrib>WOELFING BERND ; AUCHTER-KRUMMEL PETRA ; MUND DIETRICH ; PAWLOWSKI EDGAR ; BIERTUEMPFEL RALF ; BRAUNECK ULF ; HAYDEN JOSEPH S ; FOTHERINGHAM ULRICH ; SEIDEMANN VOLKER ; FLEISSNER FRANK</creatorcontrib><description>The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100128&amp;DB=EPODOC&amp;CC=US&amp;NR=2010022053A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100128&amp;DB=EPODOC&amp;CC=US&amp;NR=2010022053A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WOELFING BERND</creatorcontrib><creatorcontrib>AUCHTER-KRUMMEL PETRA</creatorcontrib><creatorcontrib>MUND DIETRICH</creatorcontrib><creatorcontrib>PAWLOWSKI EDGAR</creatorcontrib><creatorcontrib>BIERTUEMPFEL RALF</creatorcontrib><creatorcontrib>BRAUNECK ULF</creatorcontrib><creatorcontrib>HAYDEN JOSEPH S</creatorcontrib><creatorcontrib>FOTHERINGHAM ULRICH</creatorcontrib><creatorcontrib>SEIDEMANN VOLKER</creatorcontrib><creatorcontrib>FLEISSNER FRANK</creatorcontrib><title>Method for Packaging Components</title><description>The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD3TS3JyE9RSMsvUghITM5OTM_MS1dwzs8tyM9LzSsp5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGBgZGRgamxo6GxsSpAgCinyWL</recordid><startdate>20100128</startdate><enddate>20100128</enddate><creator>WOELFING BERND</creator><creator>AUCHTER-KRUMMEL PETRA</creator><creator>MUND DIETRICH</creator><creator>PAWLOWSKI EDGAR</creator><creator>BIERTUEMPFEL RALF</creator><creator>BRAUNECK ULF</creator><creator>HAYDEN JOSEPH S</creator><creator>FOTHERINGHAM ULRICH</creator><creator>SEIDEMANN VOLKER</creator><creator>FLEISSNER FRANK</creator><scope>EVB</scope></search><sort><creationdate>20100128</creationdate><title>Method for Packaging Components</title><author>WOELFING BERND ; AUCHTER-KRUMMEL PETRA ; MUND DIETRICH ; PAWLOWSKI EDGAR ; BIERTUEMPFEL RALF ; BRAUNECK ULF ; HAYDEN JOSEPH S ; FOTHERINGHAM ULRICH ; SEIDEMANN VOLKER ; FLEISSNER FRANK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2010022053A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WOELFING BERND</creatorcontrib><creatorcontrib>AUCHTER-KRUMMEL PETRA</creatorcontrib><creatorcontrib>MUND DIETRICH</creatorcontrib><creatorcontrib>PAWLOWSKI EDGAR</creatorcontrib><creatorcontrib>BIERTUEMPFEL RALF</creatorcontrib><creatorcontrib>BRAUNECK ULF</creatorcontrib><creatorcontrib>HAYDEN JOSEPH S</creatorcontrib><creatorcontrib>FOTHERINGHAM ULRICH</creatorcontrib><creatorcontrib>SEIDEMANN VOLKER</creatorcontrib><creatorcontrib>FLEISSNER FRANK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WOELFING BERND</au><au>AUCHTER-KRUMMEL PETRA</au><au>MUND DIETRICH</au><au>PAWLOWSKI EDGAR</au><au>BIERTUEMPFEL RALF</au><au>BRAUNECK ULF</au><au>HAYDEN JOSEPH S</au><au>FOTHERINGHAM ULRICH</au><au>SEIDEMANN VOLKER</au><au>FLEISSNER FRANK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for Packaging Components</title><date>2010-01-28</date><risdate>2010</risdate><abstract>The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for Packaging Components
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T18%3A36%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WOELFING%20BERND&rft.date=2010-01-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2010022053A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true