Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution

A printed circuit board (PCB) assembly is disclosed. The PCB assembly includes a first PCB, a second PCB and a land grid array (LGA). The first PCB includes signal interconnects for transmitting logic signals and power interconnects for transmitting power signals. In contrast, the second PCB include...

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Hauptverfasser:	BRODSKY WILLIAM L, COVI KEVIN R
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	BRODSKY WILLIAM L COVI KEVIN R
description	A printed circuit board (PCB) assembly is disclosed. The PCB assembly includes a first PCB, a second PCB and a land grid array (LGA). The first PCB includes signal interconnects for transmitting logic signals and power interconnects for transmitting power signals. In contrast, the second PCB includes only power interconnects for transmitting power signals exclusively. The second PCB also has significantly less vias than the first PCB. The second PCB is connected to the first PCB via the LGA.
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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution
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