INDUSTRIAL MICRODEPOSITION SYSTEM INCLUDING MASKING TO REDUCE THE IMPACT OF DROPLET ALIGNMENT AND DROPLET VOLUME TOLERANCES AND ERRORS
A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | ALBERTALLI DAVID EDWARDS CHARLES O |
description | A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2010009068A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2010009068A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2010009068A13</originalsourceid><addsrcrecordid>eNqNi80KwjAQhHvxIOo7LHgWUgXRY0i27WKSLfkRPIlIPIkW6jP43FYRz56-Yb6ZcfEkp1OInqQBS8qzxpYDRWIH4RAiWiCnTNLkarAy7N6MDB51UgixQSDbShWBK9CeW4MRpKHaWXRDcvrX7tkkO1zYoJdOYfhY9J59mBajy-na59mXk2JeYVTNInf3Y-670znf8uOYwlKUQoitWG9kufpv9QIr-T8l</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INDUSTRIAL MICRODEPOSITION SYSTEM INCLUDING MASKING TO REDUCE THE IMPACT OF DROPLET ALIGNMENT AND DROPLET VOLUME TOLERANCES AND ERRORS</title><source>esp@cenet</source><creator>ALBERTALLI DAVID ; EDWARDS CHARLES O</creator><creatorcontrib>ALBERTALLI DAVID ; EDWARDS CHARLES O</creatorcontrib><description>A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.</description><language>eng</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CORRECTION OF TYPOGRAPHICAL ERRORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PRINTING ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SELECTIVE PRINTING MECHANISMS ; SPRAYING OR ATOMISING IN GENERAL ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100114&DB=EPODOC&CC=US&NR=2010009068A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100114&DB=EPODOC&CC=US&NR=2010009068A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ALBERTALLI DAVID</creatorcontrib><creatorcontrib>EDWARDS CHARLES O</creatorcontrib><title>INDUSTRIAL MICRODEPOSITION SYSTEM INCLUDING MASKING TO REDUCE THE IMPACT OF DROPLET ALIGNMENT AND DROPLET VOLUME TOLERANCES AND ERRORS</title><description>A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINING MACHINES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PRINTING</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi80KwjAQhHvxIOo7LHgWUgXRY0i27WKSLfkRPIlIPIkW6jP43FYRz56-Yb6ZcfEkp1OInqQBS8qzxpYDRWIH4RAiWiCnTNLkarAy7N6MDB51UgixQSDbShWBK9CeW4MRpKHaWXRDcvrX7tkkO1zYoJdOYfhY9J59mBajy-na59mXk2JeYVTNInf3Y-670znf8uOYwlKUQoitWG9kufpv9QIr-T8l</recordid><startdate>20100114</startdate><enddate>20100114</enddate><creator>ALBERTALLI DAVID</creator><creator>EDWARDS CHARLES O</creator><scope>EVB</scope></search><sort><creationdate>20100114</creationdate><title>INDUSTRIAL MICRODEPOSITION SYSTEM INCLUDING MASKING TO REDUCE THE IMPACT OF DROPLET ALIGNMENT AND DROPLET VOLUME TOLERANCES AND ERRORS</title><author>ALBERTALLI DAVID ; EDWARDS CHARLES O</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2010009068A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINING MACHINES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PRINTING</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>ALBERTALLI DAVID</creatorcontrib><creatorcontrib>EDWARDS CHARLES O</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ALBERTALLI DAVID</au><au>EDWARDS CHARLES O</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INDUSTRIAL MICRODEPOSITION SYSTEM INCLUDING MASKING TO REDUCE THE IMPACT OF DROPLET ALIGNMENT AND DROPLET VOLUME TOLERANCES AND ERRORS</title><date>2010-01-14</date><risdate>2010</risdate><abstract>A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US2010009068A1 |
source | esp@cenet |
subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CORRECTION OF TYPOGRAPHICAL ERRORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SELECTIVE PRINTING MECHANISMS SPRAYING OR ATOMISING IN GENERAL STAMPS TRANSPORTING TYPEWRITERS |
title | INDUSTRIAL MICRODEPOSITION SYSTEM INCLUDING MASKING TO REDUCE THE IMPACT OF DROPLET ALIGNMENT AND DROPLET VOLUME TOLERANCES AND ERRORS |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T08%3A33%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ALBERTALLI%20DAVID&rft.date=2010-01-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2010009068A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |