ABRASIVE POWDER COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH

ABRASIVE POWDER COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH

An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix.

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Hauptverfasser: HUMPHREY DAVID, JACKSON MERRILL
Format: Patent
Sprache:eng
Schlagworte:
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
PERFORMING OPERATIONS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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creator HUMPHREY DAVID
JACKSON MERRILL
description An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2010003398A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2010003398A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2010003398A13</originalsourceid><addsrcrecordid>eNrjZHBzdApyDPYMc1UI8A93cQ1ScPZ3DPH0cw9WcPRzUfB1DfHwdwlWcPMPUvD08_B08gTJKQAJhXAPz2BvoHr3IP_wEA8eBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhIfGmxkYGhgYGBsbGnhaGhMnCoAYhAtQQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ABRASIVE POWDER COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH</title><source>esp@cenet</source><creator>HUMPHREY DAVID ; JACKSON MERRILL</creator><creatorcontrib>HUMPHREY DAVID ; JACKSON MERRILL</creatorcontrib><description>An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix.</description><language>eng</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; PERFORMING OPERATIONS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100107&amp;DB=EPODOC&amp;CC=US&amp;NR=2010003398A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20100107&amp;DB=EPODOC&amp;CC=US&amp;NR=2010003398A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUMPHREY DAVID</creatorcontrib><creatorcontrib>JACKSON MERRILL</creatorcontrib><title>ABRASIVE POWDER COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH</title><description>An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix.</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBzdApyDPYMc1UI8A93cQ1ScPZ3DPH0cw9WcPRzUfB1DfHwdwlWcPMPUvD08_B08gTJKQAJhXAPz2BvoHr3IP_wEA8eBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhIfGmxkYGhgYGBsbGnhaGhMnCoAYhAtQQ</recordid><startdate>20100107</startdate><enddate>20100107</enddate><creator>HUMPHREY DAVID</creator><creator>JACKSON MERRILL</creator><scope>EVB</scope></search><sort><creationdate>20100107</creationdate><title>ABRASIVE POWDER COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH</title><author>HUMPHREY DAVID ; JACKSON MERRILL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2010003398A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2010</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HUMPHREY DAVID</creatorcontrib><creatorcontrib>JACKSON MERRILL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUMPHREY DAVID</au><au>JACKSON MERRILL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ABRASIVE POWDER COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH</title><date>2010-01-07</date><risdate>2010</risdate><abstract>An electrical component includes a conductive substrate, a tin layer formed on the substrate, and a barrier coating formed on the tin layer to impede tin whisker growth. The barrier coating includes a polymer matrix, and abrasive particles that are dispersed about the matrix.</abstract><oa>free_for_read</oa></addata></record>
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recordid cdi_epo_espacenet_US2010003398A1
source esp@cenet
subjects APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
PERFORMING OPERATIONS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title ABRASIVE POWDER COATINGS AND METHODS FOR INHIBITING TIN WHISKER GROWTH
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T19%3A12%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HUMPHREY%20DAVID&rft.date=2010-01-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2010003398A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true