Semiconductor Die Separation Method

According to the invention, die shift is reduced or substantially eliminated, by cutting the wafer in two stages. In some embodiments a first wafer cutting procedure is carried out prior to thinning the wafer to the prescribed die thickness; and in other embodiments the wafer is thinned to the presc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PAN WEIPING, VILLAVICENCIO GRANT, MELCHER DEANN EILEEN, CO REYNALDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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