MULTI-LAYER ADHESIVE FILM FOR DIE STACKING

An adhesive film for die stacking at least two neighboring semiconductor dies containing metal wire bonds, comprises (a) Layer-1 adhesive, which comes in contact with the first semiconductor die and is capable of flowing around the metal wire bonds of that first semiconductor die at die attach tempe...

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1. Verfasser:	JIN HWAIL
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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creator	JIN HWAIL
description	An adhesive film for die stacking at least two neighboring semiconductor dies containing metal wire bonds, comprises (a) Layer-1 adhesive, which comes in contact with the first semiconductor die and is capable of flowing around the metal wire bonds of that first semiconductor die at die attach temperatures, and (b) Layer-2 adhesive, which comes in contact with the second semiconductor die, in which Layer-2 adhesive comprises 30-85 weight % thermoplastic rubber with a glass transition temperature of less than 25° C. and a weight average molecular weight of greater than 100,000.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2009311520A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2009311520A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2009311520A13</originalsourceid><addsrcrecordid>eNrjZNDyDfUJ8dT1cYx0DVJwdPFwDfYMc1Vw8_TxVXDzD1Jw8XRVCA5xdPb29HPnYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBgaWxoaGpkYGjobGxKkCAModJUY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MULTI-LAYER ADHESIVE FILM FOR DIE STACKING</title><source>esp@cenet</source><creator>JIN HWAIL</creator><creatorcontrib>JIN HWAIL</creatorcontrib><description>An adhesive film for die stacking at least two neighboring semiconductor dies containing metal wire bonds, comprises (a) Layer-1 adhesive, which comes in contact with the first semiconductor die and is capable of flowing around the metal wire bonds of that first semiconductor die at die attach temperatures, and (b) Layer-2 adhesive, which comes in contact with the second semiconductor die, in which Layer-2 adhesive comprises 30-85 weight % thermoplastic rubber with a glass transition temperature of less than 25° C. and a weight average molecular weight of greater than 100,000.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091217&DB=EPODOC&CC=US&NR=2009311520A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091217&DB=EPODOC&CC=US&NR=2009311520A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JIN HWAIL</creatorcontrib><title>MULTI-LAYER ADHESIVE FILM FOR DIE STACKING</title><description>An adhesive film for die stacking at least two neighboring semiconductor dies containing metal wire bonds, comprises (a) Layer-1 adhesive, which comes in contact with the first semiconductor die and is capable of flowing around the metal wire bonds of that first semiconductor die at die attach temperatures, and (b) Layer-2 adhesive, which comes in contact with the second semiconductor die, in which Layer-2 adhesive comprises 30-85 weight % thermoplastic rubber with a glass transition temperature of less than 25° C. and a weight average molecular weight of greater than 100,000.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDyDfUJ8dT1cYx0DVJwdPFwDfYMc1Vw8_TxVXDzD1Jw8XRVCA5xdPb29HPnYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBgaWxoaGpkYGjobGxKkCAModJUY</recordid><startdate>20091217</startdate><enddate>20091217</enddate><creator>JIN HWAIL</creator><scope>EVB</scope></search><sort><creationdate>20091217</creationdate><title>MULTI-LAYER ADHESIVE FILM FOR DIE STACKING</title><author>JIN HWAIL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2009311520A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>JIN HWAIL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JIN HWAIL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTI-LAYER ADHESIVE FILM FOR DIE STACKING</title><date>2009-12-17</date><risdate>2009</risdate><abstract>An adhesive film for die stacking at least two neighboring semiconductor dies containing metal wire bonds, comprises (a) Layer-1 adhesive, which comes in contact with the first semiconductor die and is capable of flowing around the metal wire bonds of that first semiconductor die at die attach temperatures, and (b) Layer-2 adhesive, which comes in contact with the second semiconductor die, in which Layer-2 adhesive comprises 30-85 weight % thermoplastic rubber with a glass transition temperature of less than 25° C. and a weight average molecular weight of greater than 100,000.</abstract><oa>free_for_read</oa></addata></record>
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language	eng
recordid	cdi_epo_espacenet_US2009311520A1
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subjects	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
title	MULTI-LAYER ADHESIVE FILM FOR DIE STACKING
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-15T02%3A43%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JIN%20HWAIL&rft.date=2009-12-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2009311520A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true