ELECTRONIC CARRIER BOARD
An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined wit...
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creator | LIN CHANG-FU TSAI KUOING |
description | An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined with respect to each other, thereby preventing the conductive bumps mounted on the carrying surfaces from displacement and thereby further preventing two adjacent conductive bumps subject to displacement from coming into short-circuit contact. |
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The carrying surfaces of at least two solder pads are oppositely inclined with respect to each other, thereby preventing the conductive bumps mounted on the carrying surfaces from displacement and thereby further preventing two adjacent conductive bumps subject to displacement from coming into short-circuit contact.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091105&DB=EPODOC&CC=US&NR=2009272563A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20091105&DB=EPODOC&CC=US&NR=2009272563A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN CHANG-FU</creatorcontrib><creatorcontrib>TSAI KUOING</creatorcontrib><title>ELECTRONIC CARRIER BOARD</title><description>An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined with respect to each other, thereby preventing the conductive bumps mounted on the carrying surfaces from displacement and thereby further preventing two adjacent conductive bumps subject to displacement from coming into short-circuit contact.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBw9XF1Dgny9_N0VnB2DArydA1ScPJ3DHLhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBgaWRuZGpmbGjobGxKkCAGqkIJM</recordid><startdate>20091105</startdate><enddate>20091105</enddate><creator>LIN CHANG-FU</creator><creator>TSAI KUOING</creator><scope>EVB</scope></search><sort><creationdate>20091105</creationdate><title>ELECTRONIC CARRIER BOARD</title><author>LIN CHANG-FU ; TSAI KUOING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2009272563A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN CHANG-FU</creatorcontrib><creatorcontrib>TSAI KUOING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN CHANG-FU</au><au>TSAI KUOING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC CARRIER BOARD</title><date>2009-11-05</date><risdate>2009</risdate><abstract>An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined with respect to each other, thereby preventing the conductive bumps mounted on the carrying surfaces from displacement and thereby further preventing two adjacent conductive bumps subject to displacement from coming into short-circuit contact.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | ELECTRONIC CARRIER BOARD |
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