Composition for removing protective layer in fabrication of mems and method for removing same

There is provided a composition that can effectively remove a protective coating and a primer coating that have a resistance to etching solutions and are rendered unnecessary after wet-etching treatment in MEMS fabrication processes, and a method for removing the protective layer. The composition co...

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Bibliographische Detailangaben
Hauptverfasser: XU GU, UEHARA HIROYUKI, ZHONG XING-FU, AOBA KAZUHIRO
Format: Patent
Sprache:eng
Schlagworte:
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