EXTERNALLY CONFIGURABLE INTEGRATED CIRCUITS

A die comprising two or more active electronic components is provided. The active electronic components are capable of being interconnected using interconnections external to the die. The die may be encased within a package, and the active electronic components may be interconnected using interconne...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SEARS PETER C, GELLER BERNARD D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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