PROCESS FOR SEALING AND CONNECTING PARTS OF ELECTROMECHANICAL, FLUID AND OPTICAL MICROSYSTEMS AND DEVICE OBTAINED THEREBY

A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a spacing region are formed on a second body; the spacing region extends near the electrically conductiv...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MASTROMATTEO UBALDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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