PROCESS FOR SEALING AND CONNECTING PARTS OF ELECTROMECHANICAL, FLUID AND OPTICAL MICROSYSTEMS AND DEVICE OBTAINED THEREBY

A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a spacing region are formed on a second body; the spacing region extends near the electrically conductiv...

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1. Verfasser:	MASTROMATTEO UBALDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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creator	MASTROMATTEO UBALDO
description	A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a spacing region are formed on a second body; the spacing region extends near the electrically conductive region and has a height smaller than the electrically conductive region. One of the first and second bodies is turned upside down on the other, and the two bodies are welded together by causing the electrically conductive region to melt so that it adheres to the welding region and collapses until its height becomes equal to that of the spacing region. Thereby it is possible to seal active parts or micromechanical structures with respect to the outside world, self-align the two bodies during bonding, obtain an electrical connection between the two bodies, and optically align two optical structures formed on the two bodies.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2009186447A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2009186447A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2009186447A13</originalsourceid><addsrcrecordid>eNqNi80KwjAQhHvxIOo7LHhVaFX8OaabjQ202ZKkQk-lSDyJFurFt9cWH8DTMN83M43epWUk50CxBUci1-YMwkhANobQD7UU1jtgBZR_ieWCMBNGo8hXoPJKy_HApR8QFBotu9p5KtwoJF00EnDqhTYkwWdkKa3n0eTW3vuw-OUsWirymK1D92xC37XX8AivpnKbOD4lx_1udxDJ9r_VB5hkOwk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PROCESS FOR SEALING AND CONNECTING PARTS OF ELECTROMECHANICAL, FLUID AND OPTICAL MICROSYSTEMS AND DEVICE OBTAINED THEREBY</title><source>esp@cenet</source><creator>MASTROMATTEO UBALDO</creator><creatorcontrib>MASTROMATTEO UBALDO</creatorcontrib><description>A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a spacing region are formed on a second body; the spacing region extends near the electrically conductive region and has a height smaller than the electrically conductive region. One of the first and second bodies is turned upside down on the other, and the two bodies are welded together by causing the electrically conductive region to melt so that it adheres to the welding region and collapses until its height becomes equal to that of the spacing region. Thereby it is possible to seal active parts or micromechanical structures with respect to the outside world, self-align the two bodies during bonding, obtain an electrical connection between the two bodies, and optically align two optical structures formed on the two bodies.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090723&DB=EPODOC&CC=US&NR=2009186447A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090723&DB=EPODOC&CC=US&NR=2009186447A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MASTROMATTEO UBALDO</creatorcontrib><title>PROCESS FOR SEALING AND CONNECTING PARTS OF ELECTROMECHANICAL, FLUID AND OPTICAL MICROSYSTEMS AND DEVICE OBTAINED THEREBY</title><description>A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a spacing region are formed on a second body; the spacing region extends near the electrically conductive region and has a height smaller than the electrically conductive region. One of the first and second bodies is turned upside down on the other, and the two bodies are welded together by causing the electrically conductive region to melt so that it adheres to the welding region and collapses until its height becomes equal to that of the spacing region. Thereby it is possible to seal active parts or micromechanical structures with respect to the outside world, self-align the two bodies during bonding, obtain an electrical connection between the two bodies, and optically align two optical structures formed on the two bodies.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi80KwjAQhHvxIOo7LHhVaFX8OaabjQ202ZKkQk-lSDyJFurFt9cWH8DTMN83M43epWUk50CxBUci1-YMwkhANobQD7UU1jtgBZR_ieWCMBNGo8hXoPJKy_HApR8QFBotu9p5KtwoJF00EnDqhTYkwWdkKa3n0eTW3vuw-OUsWirymK1D92xC37XX8AivpnKbOD4lx_1udxDJ9r_VB5hkOwk</recordid><startdate>20090723</startdate><enddate>20090723</enddate><creator>MASTROMATTEO UBALDO</creator><scope>EVB</scope></search><sort><creationdate>20090723</creationdate><title>PROCESS FOR SEALING AND CONNECTING PARTS OF ELECTROMECHANICAL, FLUID AND OPTICAL MICROSYSTEMS AND DEVICE OBTAINED THEREBY</title><author>MASTROMATTEO UBALDO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2009186447A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MASTROMATTEO UBALDO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MASTROMATTEO UBALDO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESS FOR SEALING AND CONNECTING PARTS OF ELECTROMECHANICAL, FLUID AND OPTICAL MICROSYSTEMS AND DEVICE OBTAINED THEREBY</title><date>2009-07-23</date><risdate>2009</risdate><abstract>A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a spacing region are formed on a second body; the spacing region extends near the electrically conductive region and has a height smaller than the electrically conductive region. One of the first and second bodies is turned upside down on the other, and the two bodies are welded together by causing the electrically conductive region to melt so that it adheres to the welding region and collapses until its height becomes equal to that of the spacing region. Thereby it is possible to seal active parts or micromechanical structures with respect to the outside world, self-align the two bodies during bonding, obtain an electrical connection between the two bodies, and optically align two optical structures formed on the two bodies.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
title	PROCESS FOR SEALING AND CONNECTING PARTS OF ELECTROMECHANICAL, FLUID AND OPTICAL MICROSYSTEMS AND DEVICE OBTAINED THEREBY
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T20%3A43%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MASTROMATTEO%20UBALDO&rft.date=2009-07-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2009186447A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true