REDUCING INTRODUCTION OF FOREIGN MATERIAL TO WAFERS
A system and method of reducing the introduction of foreign material to wafers. A system includes an enclosure structured and arranged to carry wafers used in semiconductor device manufacturing, and an attractive material arranged as at least a portion of an interior surface of the enclosure.
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creator | EASTON ALISON K FLUEGEL JAMES E PETERMAN JAMES H CLARK DAVID J |
description | A system and method of reducing the introduction of foreign material to wafers. A system includes an enclosure structured and arranged to carry wafers used in semiconductor device manufacturing, and an attractive material arranged as at least a portion of an interior surface of the enclosure. |
format | Patent |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | REDUCING INTRODUCTION OF FOREIGN MATERIAL TO WAFERS |
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