SEMICONDUCTOR DEVICE INCLUDING MAIN SUBSTRATE AND SUB SUBSTRATES AND FABRICATION METHOD OF THE SAME

A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MINAKAWA ATSUSHI, SEKIYA MAMORU, UMEZU NORIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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