Light emitting diode device

Light emitting diode device

A light emitting diode device includes a light emitting diode chip, a thermal conducting part, two electric conducting parts and two first conducting wires. The light emitting diode chip has a surface and two electrodes disposed on the surface. The thermal conducting part is electrically insulated t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HSIEH CHUNGUAN, PEI CHIENANG, CHANG CHIA-HSIEN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HSIEH CHUNGUAN
PEI CHIENANG
CHANG CHIA-HSIEN
description A light emitting diode device includes a light emitting diode chip, a thermal conducting part, two electric conducting parts and two first conducting wires. The light emitting diode chip has a surface and two electrodes disposed on the surface. The thermal conducting part is electrically insulated to the electrodes. The thermal conducting part includes a core bearing the light emitting diode chip, and four outward lead-frames connected to the core. The electric conducting parts are electrically insulated to the thermal conducting part. The first conducting wires have ends electrically connected to the electrodes.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2009085051A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2009085051A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2009085051A13</originalsourceid><addsrcrecordid>eNrjZJD2yUzPKFFIzc0sKcnMS1dIycxPSVVISS3LTE7lYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBgaWBhamBqaGjobGxKkCAO_dJCA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light emitting diode device</title><source>esp@cenet</source><creator>HSIEH CHUNGUAN ; PEI CHIENANG ; CHANG CHIA-HSIEN</creator><creatorcontrib>HSIEH CHUNGUAN ; PEI CHIENANG ; CHANG CHIA-HSIEN</creatorcontrib><description>A light emitting diode device includes a light emitting diode chip, a thermal conducting part, two electric conducting parts and two first conducting wires. The light emitting diode chip has a surface and two electrodes disposed on the surface. The thermal conducting part is electrically insulated to the electrodes. The thermal conducting part includes a core bearing the light emitting diode chip, and four outward lead-frames connected to the core. The electric conducting parts are electrically insulated to the thermal conducting part. The first conducting wires have ends electrically connected to the electrodes.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090402&amp;DB=EPODOC&amp;CC=US&amp;NR=2009085051A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090402&amp;DB=EPODOC&amp;CC=US&amp;NR=2009085051A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HSIEH CHUNGUAN</creatorcontrib><creatorcontrib>PEI CHIENANG</creatorcontrib><creatorcontrib>CHANG CHIA-HSIEN</creatorcontrib><title>Light emitting diode device</title><description>A light emitting diode device includes a light emitting diode chip, a thermal conducting part, two electric conducting parts and two first conducting wires. The light emitting diode chip has a surface and two electrodes disposed on the surface. The thermal conducting part is electrically insulated to the electrodes. The thermal conducting part includes a core bearing the light emitting diode chip, and four outward lead-frames connected to the core. The electric conducting parts are electrically insulated to the thermal conducting part. The first conducting wires have ends electrically connected to the electrodes.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD2yUzPKFFIzc0sKcnMS1dIycxPSVVISS3LTE7lYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBgaWBhamBqaGjobGxKkCAO_dJCA</recordid><startdate>20090402</startdate><enddate>20090402</enddate><creator>HSIEH CHUNGUAN</creator><creator>PEI CHIENANG</creator><creator>CHANG CHIA-HSIEN</creator><scope>EVB</scope></search><sort><creationdate>20090402</creationdate><title>Light emitting diode device</title><author>HSIEH CHUNGUAN ; PEI CHIENANG ; CHANG CHIA-HSIEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2009085051A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HSIEH CHUNGUAN</creatorcontrib><creatorcontrib>PEI CHIENANG</creatorcontrib><creatorcontrib>CHANG CHIA-HSIEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HSIEH CHUNGUAN</au><au>PEI CHIENANG</au><au>CHANG CHIA-HSIEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light emitting diode device</title><date>2009-04-02</date><risdate>2009</risdate><abstract>A light emitting diode device includes a light emitting diode chip, a thermal conducting part, two electric conducting parts and two first conducting wires. The light emitting diode chip has a surface and two electrodes disposed on the surface. The thermal conducting part is electrically insulated to the electrodes. The thermal conducting part includes a core bearing the light emitting diode chip, and four outward lead-frames connected to the core. The electric conducting parts are electrically insulated to the thermal conducting part. The first conducting wires have ends electrically connected to the electrodes.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2009085051A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light emitting diode device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T06%3A40%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HSIEH%20CHUNGUAN&rft.date=2009-04-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2009085051A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true