DIELECTRIC SPACER REMOVAL

The present invention relates to semiconductor devices, and more particularly to a process and structure for removing a dielectric spacer selective to a surface of a semiconductor substrate with substantially no removal of the semiconductor substrate. The method of the present invention can be integ...

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Bibliographische Detailangaben
Hauptverfasser: PARUCHURI VAMSI, STEEN MICHELLE L, JHA RASHMI, MO RENEE T, WISE RICHARD, ZHANG YING, CARTIER EDUARD A, KANAKASABAPATHY SIVANANDA, NARAYANAN VIJAY, LI XI, ROBSON MARK T, SCHONENBERG KATHRYN T
Format: Patent
Sprache:eng
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