CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and als...
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| creator | HERCHEN HARALD ARMER HELEN R BACKER JOHN A LUE BRIAN ISHIKAWA TETSUYA LOWRANCE ROBERT HUDGENS JEFFREY PINSON JAY D WANG CHONGYANG CARLSON CHARLES ROBERTS RICK J RICE MICHAEL QUACH DAVID H WEAVER WILLIAM TYLER SALEK MOHSEN S VOLFOVSKI LEON |
| description | Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2009064928A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2009064928A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2009064928A13</originalsourceid><addsrcrecordid>eNrjZDBx9gkNDnENUgjx9_dRcAxy9vAMcXUOCQ1yVXDzD1IICPJ3dg0O9vRzV3BUCA51Cg4Jcgxx5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgYGlgZmJpZGFo6GxsSpAgCGryik</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE</title><source>esp@cenet</source><creator>HERCHEN HARALD ; ARMER HELEN R ; BACKER JOHN A ; LUE BRIAN ; ISHIKAWA TETSUYA ; LOWRANCE ROBERT ; HUDGENS JEFFREY ; PINSON JAY D ; WANG CHONGYANG ; CARLSON CHARLES ; ROBERTS RICK J ; RICE MICHAEL ; QUACH DAVID H ; WEAVER WILLIAM TYLER ; SALEK MOHSEN S ; VOLFOVSKI LEON</creator><creatorcontrib>HERCHEN HARALD ; ARMER HELEN R ; BACKER JOHN A ; LUE BRIAN ; ISHIKAWA TETSUYA ; LOWRANCE ROBERT ; HUDGENS JEFFREY ; PINSON JAY D ; WANG CHONGYANG ; CARLSON CHARLES ; ROBERTS RICK J ; RICE MICHAEL ; QUACH DAVID H ; WEAVER WILLIAM TYLER ; SALEK MOHSEN S ; VOLFOVSKI LEON</creatorcontrib><description>Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.</description><language>eng</language><subject>ACCESSORIES THEREFOR ; APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS ; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES ; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM ; APPARATUS SPECIALLY ADAPTED THEREFOR ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ; CONTROL OR REGULATING SYSTEMS IN GENERAL ; CONTROLLING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; HOLOGRAPHY ; MATERIALS THEREFOR ; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; REGULATING ; SEMICONDUCTOR DEVICES ; SPRAYING OR ATOMISING IN GENERAL ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS ; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE ; TRANSPORTING</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090312&DB=EPODOC&CC=US&NR=2009064928A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090312&DB=EPODOC&CC=US&NR=2009064928A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HERCHEN HARALD</creatorcontrib><creatorcontrib>ARMER HELEN R</creatorcontrib><creatorcontrib>BACKER JOHN A</creatorcontrib><creatorcontrib>LUE BRIAN</creatorcontrib><creatorcontrib>ISHIKAWA TETSUYA</creatorcontrib><creatorcontrib>LOWRANCE ROBERT</creatorcontrib><creatorcontrib>HUDGENS JEFFREY</creatorcontrib><creatorcontrib>PINSON JAY D</creatorcontrib><creatorcontrib>WANG CHONGYANG</creatorcontrib><creatorcontrib>CARLSON CHARLES</creatorcontrib><creatorcontrib>ROBERTS RICK J</creatorcontrib><creatorcontrib>RICE MICHAEL</creatorcontrib><creatorcontrib>QUACH DAVID H</creatorcontrib><creatorcontrib>WEAVER WILLIAM TYLER</creatorcontrib><creatorcontrib>SALEK MOHSEN S</creatorcontrib><creatorcontrib>VOLFOVSKI LEON</creatorcontrib><title>CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE</title><description>Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.</description><subject>ACCESSORIES THEREFOR</subject><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS</subject><subject>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</subject><subject>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</subject><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</subject><subject>CONTROL OR REGULATING SYSTEMS IN GENERAL</subject><subject>CONTROLLING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>REGULATING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBx9gkNDnENUgjx9_dRcAxy9vAMcXUOCQ1yVXDzD1IICPJ3dg0O9vRzV3BUCA51Cg4Jcgxx5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgYGlgZmJpZGFo6GxsSpAgCGryik</recordid><startdate>20090312</startdate><enddate>20090312</enddate><creator>HERCHEN HARALD</creator><creator>ARMER HELEN R</creator><creator>BACKER JOHN A</creator><creator>LUE BRIAN</creator><creator>ISHIKAWA TETSUYA</creator><creator>LOWRANCE ROBERT</creator><creator>HUDGENS JEFFREY</creator><creator>PINSON JAY D</creator><creator>WANG CHONGYANG</creator><creator>CARLSON CHARLES</creator><creator>ROBERTS RICK J</creator><creator>RICE MICHAEL</creator><creator>QUACH DAVID H</creator><creator>WEAVER WILLIAM TYLER</creator><creator>SALEK MOHSEN S</creator><creator>VOLFOVSKI LEON</creator><scope>EVB</scope></search><sort><creationdate>20090312</creationdate><title>CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE</title><author>HERCHEN HARALD ; ARMER HELEN R ; BACKER JOHN A ; LUE BRIAN ; ISHIKAWA TETSUYA ; LOWRANCE ROBERT ; HUDGENS JEFFREY ; PINSON JAY D ; WANG CHONGYANG ; CARLSON CHARLES ; ROBERTS RICK J ; RICE MICHAEL ; QUACH DAVID H ; WEAVER WILLIAM TYLER ; SALEK MOHSEN S ; VOLFOVSKI LEON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2009064928A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>ACCESSORIES THEREFOR</topic><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS</topic><topic>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</topic><topic>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</topic><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS</topic><topic>CONTROL OR REGULATING SYSTEMS IN GENERAL</topic><topic>CONTROLLING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>REGULATING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HERCHEN HARALD</creatorcontrib><creatorcontrib>ARMER HELEN R</creatorcontrib><creatorcontrib>BACKER JOHN A</creatorcontrib><creatorcontrib>LUE BRIAN</creatorcontrib><creatorcontrib>ISHIKAWA TETSUYA</creatorcontrib><creatorcontrib>LOWRANCE ROBERT</creatorcontrib><creatorcontrib>HUDGENS JEFFREY</creatorcontrib><creatorcontrib>PINSON JAY D</creatorcontrib><creatorcontrib>WANG CHONGYANG</creatorcontrib><creatorcontrib>CARLSON CHARLES</creatorcontrib><creatorcontrib>ROBERTS RICK J</creatorcontrib><creatorcontrib>RICE MICHAEL</creatorcontrib><creatorcontrib>QUACH DAVID H</creatorcontrib><creatorcontrib>WEAVER WILLIAM TYLER</creatorcontrib><creatorcontrib>SALEK MOHSEN S</creatorcontrib><creatorcontrib>VOLFOVSKI LEON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HERCHEN HARALD</au><au>ARMER HELEN R</au><au>BACKER JOHN A</au><au>LUE BRIAN</au><au>ISHIKAWA TETSUYA</au><au>LOWRANCE ROBERT</au><au>HUDGENS JEFFREY</au><au>PINSON JAY D</au><au>WANG CHONGYANG</au><au>CARLSON CHARLES</au><au>ROBERTS RICK J</au><au>RICE MICHAEL</au><au>QUACH DAVID H</au><au>WEAVER WILLIAM TYLER</au><au>SALEK MOHSEN S</au><au>VOLFOVSKI LEON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE</title><date>2009-03-12</date><risdate>2009</risdate><abstract>Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ACCESSORIES THEREFOR APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FUNCTIONAL ELEMENTS OF SUCH SYSTEMS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HOLOGRAPHY MATERIALS THEREFOR MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS REGULATING SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE TRANSPORTING |
| title | CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T12%3A01%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HERCHEN%20HARALD&rft.date=2009-03-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2009064928A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |