ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE
An adhesive encapsulating composition and an encapsulating film, which are useful as an encapsulant for an organic electroluminescence device or other electronic devices is provided. The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resi...
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| creator | FUJITA JUN YAMASAKI TAKASHI KOBORI NAMI MINAMI HIDEKI |
| description | An adhesive encapsulating composition and an encapsulating film, which are useful as an encapsulant for an organic electroluminescence device or other electronic devices is provided. The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin having a weight average molecular weight of 500,000 or more. Some embodiments of the adhesive encapsulating.composition include a hydrogenated cyclic olefin-based polymer, a polyisobutylene resin having a weight average molecular weight of 500,000 or more, a photocurable resin, and a photopolymerization initiator. |
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The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin having a weight average molecular weight of 500,000 or more. Some embodiments of the adhesive encapsulating.composition include a hydrogenated cyclic olefin-based polymer, a polyisobutylene resin having a weight average molecular weight of 500,000 or more, a photocurable resin, and a photopolymerization initiator.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090129&DB=EPODOC&CC=US&NR=2009026934A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090129&DB=EPODOC&CC=US&NR=2009026934A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJITA JUN</creatorcontrib><creatorcontrib>YAMASAKI TAKASHI</creatorcontrib><creatorcontrib>KOBORI NAMI</creatorcontrib><creatorcontrib>MINAMI HIDEKI</creatorcontrib><title>ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE</title><description>An adhesive encapsulating composition and an encapsulating film, which are useful as an encapsulant for an organic electroluminescence device or other electronic devices is provided. The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin having a weight average molecular weight of 500,000 or more. Some embodiments of the adhesive encapsulating.composition include a hydrogenated cyclic olefin-based polymer, a polyisobutylene resin having a weight average molecular weight of 500,000 or more, a photocurable resin, and a photopolymerization initiator.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy7EKwjAQgOEsDqK-w4GzEFsROobrtT1ILqVJupYicRIt1PdHBx_A6V--f6vE1B0FHglI0PQhWRNZWkDveh84shdo2DowUoMfWiOMQJYwDt4mx0IBvydBTSMj7dXmPj_WfPh1p44NRexOeXlNeV3mW37m95RCoXWli2tVXsy5_E99APKhL7E</recordid><startdate>20090129</startdate><enddate>20090129</enddate><creator>FUJITA JUN</creator><creator>YAMASAKI TAKASHI</creator><creator>KOBORI NAMI</creator><creator>MINAMI HIDEKI</creator><scope>EVB</scope></search><sort><creationdate>20090129</creationdate><title>ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE</title><author>FUJITA JUN ; YAMASAKI TAKASHI ; KOBORI NAMI ; MINAMI HIDEKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2009026934A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2009</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJITA JUN</creatorcontrib><creatorcontrib>YAMASAKI TAKASHI</creatorcontrib><creatorcontrib>KOBORI NAMI</creatorcontrib><creatorcontrib>MINAMI HIDEKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJITA JUN</au><au>YAMASAKI TAKASHI</au><au>KOBORI NAMI</au><au>MINAMI HIDEKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE</title><date>2009-01-29</date><risdate>2009</risdate><abstract>An adhesive encapsulating composition and an encapsulating film, which are useful as an encapsulant for an organic electroluminescence device or other electronic devices is provided. The adhesive encapsulating composition includes a hydrogenated cyclic olefin-based polymer and a polyisobutylene resin having a weight average molecular weight of 500,000 or more. Some embodiments of the adhesive encapsulating.composition include a hydrogenated cyclic olefin-based polymer, a polyisobutylene resin having a weight average molecular weight of 500,000 or more, a photocurable resin, and a photopolymerization initiator.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE ENCAPSULATING COMPOSITION FILM AND ORGANIC ELECTROLUMINESCENCE DEVICE |
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