COLLAPSABLE CONNECTION MOLD REPAIR METHOD UTILIZING FEMTOSECOND LASER PULSE LENGTHS

A method for repairing molds for collapsible connections utilizing a femtosecond laser pulse length. Also provided is a laser source for implementing a multistep profile repair process for the removal of excess material in C4 molds by utilizing the femtosecond laser pulse lengths.

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Bibliographische Detailangaben
Hauptverfasser: NEARY TIMOTHY E, PROBSTFIELD ERIK M
Format: Patent
Sprache:eng
Schlagworte:
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