DEVICE AND METHOD FOR FABRICATING DOUBLE-SIDED SOI WAFER SCALE PACKAGE WITH OPTICAL THROUGH VIA CONNECTIONS

A semiconductor package includes an SOI wafer having a first side including an integrated circuit system, and a second side, opposite the first side, forming at least one cavity. At least one chip or component is placed in the cavity. An optical through via is formed through a buried oxide which opt...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HSU LOUIS LUN, CHEN HOWARD HAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!