Adhesive agent and inkjet head and manufacturing method thereof

Disclosed is an adhesive agent which is curable and has flexibility at low temperature, and further has resistant to solvent type ink. The adhesive agent includes a base and an activator, wherein the base includes at least any one of: bisphenol F epoxy compound; bisphenol F epoxy compound mixed with...

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Hauptverfasser: TANISHO HAJIME, YOSHIZAWA TOMOMI, HIRANO TADASHI, ITO TAKESHI, NOMORI HIROYUKI
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creator TANISHO HAJIME
YOSHIZAWA TOMOMI
HIRANO TADASHI
ITO TAKESHI
NOMORI HIROYUKI
description Disclosed is an adhesive agent which is curable and has flexibility at low temperature, and further has resistant to solvent type ink. The adhesive agent includes a base and an activator, wherein the base includes at least any one of: bisphenol F epoxy compound; bisphenol F epoxy compound mixed with an epoxy compound having three or more epoxy groups; and bisphenol A epoxy compound mixed with an epoxy compound having three or more epoxy groups, wherein the activator includes: 100 parts by mass of polyamide composed of a condensation reaction product of C36 unsaturated fatty acid dimer and polyamine; and 5 to 200 parts by mass of alicyclic polyamine, and wherein the base is mixed with the activator with a ratio of 10 to 200 parts by mass of the activator with respect to 100 parts by mass of the base.
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CORRECTION OF TYPOGRAPHICAL ERRORS
DYES
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PERFORMING OPERATIONS
POLISHES
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
TYPEWRITERS
USE OF MATERIALS AS ADHESIVES
title Adhesive agent and inkjet head and manufacturing method thereof
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