HEAT SPREADER COMPOSITIONS AND MATERIALS, INTEGRATED CIRCUITRY, METHODS OF PRODUCTION AND USES THEREOF

HEAT SPREADER COMPOSITIONS AND MATERIALS, INTEGRATED CIRCUITRY, METHODS OF PRODUCTION AND USES THEREOF

Near net shape heat spreader components are disclosed that comprise at least one pressure-treated powder material. Heat spreaders are also described that include at least one near net shape heat spreader component, and at least one additional part. Methods of forming heat spreaders are also describe...

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Hauptverfasser: KOCH JAMES L, FLINT JAMES P, RUCHERT BRIAN D, UNDERWOOD PATRICK K
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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creator KOCH JAMES L
FLINT JAMES P
RUCHERT BRIAN D
UNDERWOOD PATRICK K
description Near net shape heat spreader components are disclosed that comprise at least one pressure-treated powder material. Heat spreaders are also described that include at least one near net shape heat spreader component, and at least one additional part. Methods of forming heat spreaders are also described that include: a) forming a base portion comprising a pressure-treated powder material and having a first surface comprising a perimeter region surrounding a heat-receiving surface; b) forming a frame portion comprising a second material; and c) joining the base portion and the frame portion.
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title HEAT SPREADER COMPOSITIONS AND MATERIALS, INTEGRATED CIRCUITRY, METHODS OF PRODUCTION AND USES THEREOF
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