METHOD OF PACKAGING INTEGRATED CIRCUITS

A method of packaging integrated circuit dice into exposed die packages is described. The method includes depositing a metallic layer onto the back surface of an integrated circuit wafer such that it covers the back surface. The method additionally includes applying a protective layer over the metal...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BAYAN JAIME A, TU NGHIA, WONG WILL K
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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