MICROELECTRONIC COMPONENT ASSEMBLIES EMPLOYING LEAD FRAMES HAVING REDUCED-THICKNESS INNER LENGTHS

The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HOCK CHUAN TAN, SHING MICHAEL TAN KIAN, BENG CHYE CHEW, CHEE PENG NEO, MING DAVID CHAI YIH
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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