Semiconductor package with plated connection

A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting material, a plating material and an insulating material. The die has a processed surface facing towards...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LUO LEESHAWN, ZHANG XIAO TIAN, SUN MING, LIU KAI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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