Plastic Conductive Particles and Manufacturing Method Thereof

Plastic conductive particles having an outer diameter of 2.5 mum~1 mm obtained by sequentially plating a 0.1~10 mum thick metal plating layer and a 1~100 mum thick Pb solder layer or a Pb-free solder layer on plastic core beads having a high elastic modulus of compression, and a method of manufactur...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM KYUNG HEUM, KIM SEUNG BUM, PARK KYOUNG BAE, LEE SUNG SOO, YOO BYOUNG JAE, MIN BYUNG HOON, KIM NAM GYOL
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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