Printed circuit board substrate and method for constructing same
A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | BOIS KARL JOSEPH MICHALKA TIMOTHY L |
| description | A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in the first dielectric material and a second signal path layer is embedded in the second dielectric material, wherein the first and second signal path layers are substantially parallel to each other in a stack-up arrangement. An adhesive layer is interposed between the first dielectric material and the second dielectric material. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2008196933A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2008196933A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2008196933A13</originalsourceid><addsrcrecordid>eNrjZHAIKMrMK0lNUUjOLEouzSxRSMpPLEpRKC5NKi4pSixJVUjMS1HITS3JyE9RSMsvUkjOzwNKlCaXZOalKxQn5qbyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjAwMLQ0szS2NjR0Nj4lQBALg2Mp8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Printed circuit board substrate and method for constructing same</title><source>esp@cenet</source><creator>BOIS KARL JOSEPH ; MICHALKA TIMOTHY L</creator><creatorcontrib>BOIS KARL JOSEPH ; MICHALKA TIMOTHY L</creatorcontrib><description>A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in the first dielectric material and a second signal path layer is embedded in the second dielectric material, wherein the first and second signal path layers are substantially parallel to each other in a stack-up arrangement. An adhesive layer is interposed between the first dielectric material and the second dielectric material.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080821&DB=EPODOC&CC=US&NR=2008196933A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080821&DB=EPODOC&CC=US&NR=2008196933A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BOIS KARL JOSEPH</creatorcontrib><creatorcontrib>MICHALKA TIMOTHY L</creatorcontrib><title>Printed circuit board substrate and method for constructing same</title><description>A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in the first dielectric material and a second signal path layer is embedded in the second dielectric material, wherein the first and second signal path layers are substantially parallel to each other in a stack-up arrangement. An adhesive layer is interposed between the first dielectric material and the second dielectric material.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAIKMrMK0lNUUjOLEouzSxRSMpPLEpRKC5NKi4pSixJVUjMS1HITS3JyE9RSMsvUkjOzwNKlCaXZOalKxQn5qbyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjAwMLQ0szS2NjR0Nj4lQBALg2Mp8</recordid><startdate>20080821</startdate><enddate>20080821</enddate><creator>BOIS KARL JOSEPH</creator><creator>MICHALKA TIMOTHY L</creator><scope>EVB</scope></search><sort><creationdate>20080821</creationdate><title>Printed circuit board substrate and method for constructing same</title><author>BOIS KARL JOSEPH ; MICHALKA TIMOTHY L</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2008196933A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>BOIS KARL JOSEPH</creatorcontrib><creatorcontrib>MICHALKA TIMOTHY L</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BOIS KARL JOSEPH</au><au>MICHALKA TIMOTHY L</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed circuit board substrate and method for constructing same</title><date>2008-08-21</date><risdate>2008</risdate><abstract>A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in the first dielectric material and a second signal path layer is embedded in the second dielectric material, wherein the first and second signal path layers are substantially parallel to each other in a stack-up arrangement. An adhesive layer is interposed between the first dielectric material and the second dielectric material.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2008196933A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Printed circuit board substrate and method for constructing same |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T18%3A15%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BOIS%20KARL%20JOSEPH&rft.date=2008-08-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2008196933A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |