Process for reflow soldering
The invention relates to a process for the reflow soldering of printed circuit board assemblies provided with solder paste in a sealed chamber with heating in the chamber. In a first process step, the pressure in the chamber is amplified in comparison with the atmospheric pressure and the temperatur...
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| creator | DIEHM ROLF LUDWIG WALTER MARKUS LETTNER HORST |
| description | The invention relates to a process for the reflow soldering of printed circuit board assemblies provided with solder paste in a sealed chamber with heating in the chamber. In a first process step, the pressure in the chamber is amplified in comparison with the atmospheric pressure and the temperature in the chamber is increased by convection heating to melt the solder paste and, in a second process step, the pressure is again lowered to atmospheric pressure in controlled manner while maintaining the temperature. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2008185421A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2008185421A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2008185421A13</originalsourceid><addsrcrecordid>eNrjZJAJKMpPTi0uVkjLL1IoSk3LyS9XKM7PSUktysxL52FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgYGFoYWpiZGho6GxsSpAgA8XCTR</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Process for reflow soldering</title><source>esp@cenet</source><creator>DIEHM ROLF LUDWIG ; WALTER MARKUS ; LETTNER HORST</creator><creatorcontrib>DIEHM ROLF LUDWIG ; WALTER MARKUS ; LETTNER HORST</creatorcontrib><description>The invention relates to a process for the reflow soldering of printed circuit board assemblies provided with solder paste in a sealed chamber with heating in the chamber. In a first process step, the pressure in the chamber is amplified in comparison with the atmospheric pressure and the temperature in the chamber is increased by convection heating to melt the solder paste and, in a second process step, the pressure is again lowered to atmospheric pressure in controlled manner while maintaining the temperature.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080807&DB=EPODOC&CC=US&NR=2008185421A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080807&DB=EPODOC&CC=US&NR=2008185421A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DIEHM ROLF LUDWIG</creatorcontrib><creatorcontrib>WALTER MARKUS</creatorcontrib><creatorcontrib>LETTNER HORST</creatorcontrib><title>Process for reflow soldering</title><description>The invention relates to a process for the reflow soldering of printed circuit board assemblies provided with solder paste in a sealed chamber with heating in the chamber. In a first process step, the pressure in the chamber is amplified in comparison with the atmospheric pressure and the temperature in the chamber is increased by convection heating to melt the solder paste and, in a second process step, the pressure is again lowered to atmospheric pressure in controlled manner while maintaining the temperature.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAJKMpPTi0uVkjLL1IoSk3LyS9XKM7PSUktysxL52FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgYGFoYWpiZGho6GxsSpAgA8XCTR</recordid><startdate>20080807</startdate><enddate>20080807</enddate><creator>DIEHM ROLF LUDWIG</creator><creator>WALTER MARKUS</creator><creator>LETTNER HORST</creator><scope>EVB</scope></search><sort><creationdate>20080807</creationdate><title>Process for reflow soldering</title><author>DIEHM ROLF LUDWIG ; WALTER MARKUS ; LETTNER HORST</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2008185421A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2008</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>DIEHM ROLF LUDWIG</creatorcontrib><creatorcontrib>WALTER MARKUS</creatorcontrib><creatorcontrib>LETTNER HORST</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DIEHM ROLF LUDWIG</au><au>WALTER MARKUS</au><au>LETTNER HORST</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Process for reflow soldering</title><date>2008-08-07</date><risdate>2008</risdate><abstract>The invention relates to a process for the reflow soldering of printed circuit board assemblies provided with solder paste in a sealed chamber with heating in the chamber. In a first process step, the pressure in the chamber is amplified in comparison with the atmospheric pressure and the temperature in the chamber is increased by convection heating to melt the solder paste and, in a second process step, the pressure is again lowered to atmospheric pressure in controlled manner while maintaining the temperature.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_US2008185421A1 |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Process for reflow soldering |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T00%3A11%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=DIEHM%20ROLF%20LUDWIG&rft.date=2008-08-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2008185421A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |